Loading...

PSD512B1-70JI

STMicroelectronics

PSD512B1-70JI by STMicroelectronics

PSD512B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its compact chip carrier design ensures efficient integration in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,303

-

-

-

-

Vyrian

USA . 3,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,107

-

-

-

-

Anansix

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,004 parts In-Stock

1+ parts

$63.924

100+ parts

-

1k+ parts

$57.532

10k+ parts

-

1,004

$63.924

-

$57.532

-

MKK Technologies

India . 572 parts In-Stock

1+ parts

$120.206

100+ parts

-

1k+ parts

-

10k+ parts

-

572

$120.206

-

-

-

DigiPath Technology Company

USA . 572 parts In-Stock

1+ parts

$120.206

100+ parts

-

1k+ parts

-

10k+ parts

-

572

$120.206

-

-

-

Corphita

USA . 3,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,587

-

-

-

-

Parana Technologies

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$76.431

1k+ parts

-

10k+ parts

-

7

-

$76.431

-

-

Overview

Unlock the potential of your projects with the PSD512B1-70JI from STMicroelectronics, a trusted leader in multi-functional peripherals. This versatile device combines durability and efficiency, operating seamlessly in diverse applications from industrial automation to consumer electronics. With its robust design and exceptional temperature range, it ensures reliability in even the harshest environments. Elevate your innovations with unmatched performance and stability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures long-lasting performance, making this multi-functional peripheral reliable in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes, reducing the overall footprint in electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources, providing flexibility in circuit design.

Address Bus Width: 16

A 16-bit address bus width enables access to a larger memory space, which is advantageous for complex applications requiring more resources.

Package Shape: SQUARE

The square shape provides equal distribution of thermal properties, optimizing the performance of the device in various arrangements.

No. of Terminals: 68

With 68 terminals, this device offers extensive connectivity options for integrating with other components, enhancing its versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier package style facilitates easy handling and mounting, making it an ideal choice for automated assembly processes.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage requirement of 4.5 V allows it to function efficiently even at lower power levels, contributing to energy savings.

Maximum Operating Temperature: 85 °C

Operating at a high temperature limit of 85 °C ensures reliability under stress, suitable for industrial and demanding environments.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C ensures that this product can be utilized in extreme conditions without failure, ideal for outdoor applications.

Terminal Position: QUAD

Quad terminal position simplifies soldering and wiring, leading to easier integration into complex systems.

Maximum Seated Height: 4.57 mm

A compact seated height allows for space-saving designs, making it suitable for miniaturized applications.

RAM Words: 1024

1024 RAM words provide substantial memory capacity for data processing, allowing for more complex functionalities and multitasking.

Width: 24.1808 mm

The defined width supports standardization, allowing for easy replacement and integration into existing infrastructures.

External Data Bus Width: 8

An 8-bit external data bus width allows communication with various peripherals, enabling diverse application scenarios.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz ensures fast processing speeds, enhancing the overall performance of the product.

Length: 24.1808 mm

The standard length facilitates easy integration into designs that adhere to specific dimensional constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh conditions, making it suitable for industrial and commercial use.

Technology: CMOS

CMOS technology enables lower power consumption and higher integration levels, contributing to efficient and compact designs.

Terminal Form: J BEND

J bend terminals enhance soldering quality and improve connectivity reliability in applications, ensuring a secure connection.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns well with many electronic components, simplifying power supply design.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility enhances interoperability with various systems and architectures, promoting flexibility in design.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for denser configurations and efficient PCB layouts, maximizing available space.

No. of I/O Lines: 40

Forty I/O lines provide generous interfacing capabilities, supporting a variety of input and output devices for comprehensive functionality.

Technical Specifications

Multi-functional Peripherals PSD512B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD512B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20