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CY8C3246PVI-147T

Infineon Technologies

CY8C3246PVI-147T by Infineon Technologies

Infineon's CY8C3246PVI-147T is a 48-terminal CMOS peripheral IC with 8192 RAM words, operating at up to 25 MHz. Ideal for applications requiring compatibility with various bus protocols like I2C, SPI, and UART. This multi-functional device has a small outline package style and operates b/w -40°C to 85°C.

Median Price

$8.663

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

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$8.663

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Vyrian

USA . 1,036 parts In-Stock

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1,036

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Digiode

USA . 723 parts In-Stock

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723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 529 parts In-Stock

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$8.663

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$8.489

529

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$8.489

AZTECH Wire

Italy . 493 parts In-Stock

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$12.964

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Ampacity Inc.

Singapore . 1,259 parts In-Stock

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$16.000

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$16.000

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Microchip USA

USA . 1,069 parts In-Stock

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$19.647

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1,069

$19.647

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Modulus Dynamics

Lithuania . 3,379 parts In-Stock

1+ parts

$21.192

100+ parts

$20.344

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$19.497

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3,379

$21.192

$20.344

$19.497

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Semicontronic

India . 1,334 parts In-Stock

1+ parts

$29.000

100+ parts

$28.275

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$28.130

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1,334

$29.000

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Corohmni

South Africa . 477 parts In-Stock

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$29.481

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477

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Aztec Data Supply Inc.

USA . 48,004 parts In-Stock

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$36.262

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48,004

$36.262

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QUARKTWIN TECHNOLOGY LTD

USA . 5,672 parts In-Stock

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Argo Parts USA

USA . 4,365 parts In-Stock

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Corphita

USA . 764 parts In-Stock

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Overview

Unleash the power of innovation with the CY8C3246PVI-147T by Infineon Technologies. This multi-functional peripheral device is a game-changer in the industry, offering unmatched quality and performance. With a wide range of applications, this product provides exceptional value to customers looking for reliable and efficient solutions. Say goodbye to limitations and hello to endless possibilities with the CY8C3246PVI-147T - the ultimate choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for better performance and versatility in power options.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, making it suitable for a variety of environments.

RAM Words: 8192

Ample RAM capacity allows for efficient multitasking and handling of complex tasks.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

A multi-functional peripheral offers versatile functions in a single device, saving space and cost.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for quick processing speeds and smooth operation.

Bus Compatibility: 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

Extensive bus compatibility ensures seamless integration with various systems and devices.

Technical Specifications

Multi-functional Peripherals CY8C3246PVI-147T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

25

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Words:

8192

Maximum Seated Height:

2.794 mm

Maximum Supply Current:

18.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

7.505 mm

Peripheral IC Type:

Trade Compliance

CY8C3246PVI-147T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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