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CY8C4248BZI-L489

Infineon Technologies

CY8C4248BZI-L489 by Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 124; Package Code: VFBGA; Package Shape: SQUARE;

Median Price

$8.237

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,282 parts In-Stock

1+ parts

$13.190

100+ parts

$8.912

1k+ parts

$8.312

10k+ parts

$8.132

1,282

$13.190

$8.912

$8.312

$8.132

Mouser Electronics

USA . 304 parts In-Stock

1+ parts

$13.190

100+ parts

$8.920

1k+ parts

$8.320

10k+ parts

-

304

$13.190

$8.920

$8.320

-

Flip Electronics (Authorized)

USA . 8,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,320

-

-

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.258

6,000

-

-

-

$6.258

Avnet

USA . 3,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.237

10k+ parts

$7.475

3,518

-

-

$8.237

$7.475

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$7.470

1k+ parts

$6.680

10k+ parts

$6.290

6

-

$7.470

$6.680

$6.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 81 parts In-Stock

1+ parts

$7.894

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$7.894

-

-

-

Vyrian

USA . 875 parts In-Stock

1+ parts

$8.310

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$8.310

-

-

-

Flip Electronics

USA . 7,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,615

-

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Infinite Electronics LLP

India . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,482 parts In-Stock

1+ parts

$7.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$7.060

-

-

-

Corphita

USA . 422 parts In-Stock

1+ parts

$7.479

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$7.479

-

-

-

Corohmni

South Africa . 2,140 parts In-Stock

1+ parts

$39.643

100+ parts

-

1k+ parts

-

10k+ parts

-

2,140

$39.643

-

-

-

Modulus Dynamics

Lithuania . 4,483 parts In-Stock

1+ parts

$50.070

100+ parts

$48.067

1k+ parts

$46.064

10k+ parts

-

4,483

$50.070

$48.067

$46.064

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Technical Specifications

Multi-functional Peripherals CY8C4248BZI-L489 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

NO

Bus Compatibility:

I2C; IRDA; LIN; SPI; UART; USB

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

S-PBGA-B124

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

98

No. of Terminals:

124

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA124,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

16384

Maximum Seated Height:

1 mm

Maximum Supply Current:

14.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CY8C4248BZI-L489 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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