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CY8C4247AZI-L485

Infineon Technologies

CY8C4247AZI-L485 by Infineon Technologies

CY8C4247AZI-L485 by Infineon is a 64-terminal IC with 8192 RAM words, operating at up to 48 MHz. Ideal for industrial applications, it supports I2C, IRDA, LIN, SPI, UART, and USB bus compatibility. With a temperature range of -40 to 85 °C and low profile design, it's versatile for various multi-functional peripheral uses.

Median Price

$11.610

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 367 parts In-Stock

1+ parts

$9.370

100+ parts

$6.360

1k+ parts

$6.200

10k+ parts

-

367

$9.370

$6.360

$6.200

-

DigiKey

USA . 50 parts In-Stock

1+ parts

$11.610

100+ parts

$8.478

1k+ parts

$7.202

10k+ parts

$7.077

50

$11.610

$8.478

$7.202

$7.077

Element14

Singapore . 367 parts In-Stock

1+ parts

$15.760

100+ parts

$11.370

1k+ parts

$10.730

10k+ parts

-

367

$15.760

$11.370

$10.730

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 404 parts In-Stock

1+ parts

$8.902

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$8.902

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.495

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$9.495

-

-

-

Vyrian

USA . 212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

212

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5 parts In-Stock

1+ parts

$7.850

100+ parts

$5.360

1k+ parts

-

10k+ parts

-

5

$7.850

$5.360

-

-

Ampacity Inc.

Singapore . 261 parts In-Stock

1+ parts

$7.960

100+ parts

-

1k+ parts

-

10k+ parts

-

261

$7.960

-

-

-

Semicontronic

India . 230 parts In-Stock

1+ parts

$7.960

100+ parts

$7.761

1k+ parts

$7.721

10k+ parts

-

230

$7.960

$7.761

$7.721

-

Corphita

USA . 10 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$8.433

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$9.495

100+ parts

$9.020

1k+ parts

-

10k+ parts

$8.451

120

$9.495

$9.020

-

$8.451

Modulus Dynamics

Lithuania . 3,776 parts In-Stock

1+ parts

$23.723

100+ parts

$22.774

1k+ parts

$21.825

10k+ parts

-

3,776

$23.723

$22.774

$21.825

-

Microchip USA

USA . 2,896 parts In-Stock

1+ parts

$25.953

100+ parts

-

1k+ parts

-

10k+ parts

-

2,896

$25.953

-

-

-

Aztec Data Supply Inc.

USA . 4,333 parts In-Stock

1+ parts

$48.897

100+ parts

-

1k+ parts

-

10k+ parts

-

4,333

$48.897

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$57.180

100+ parts

$54.321

1k+ parts

$54.321

10k+ parts

-

1,000

$57.180

$54.321

$54.321

-

Corohmni

South Africa . 2,033 parts In-Stock

1+ parts

$61.619

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

$61.619

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Argo Parts USA

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

-

-

-

-

Overview

Unlock endless possibilities with the CY8C4247AZI-L485 by Infineon Technologies. Crafted with precision and expertise, this multi-functional peripheral device is designed to elevate your projects to new heights. From its durable plastic/epoxy body to its impressive clock frequency of 48 MHz, this product seamlessly combines quality and performance. Whether you're working on I2C, UART, or USB applications, this versatile IC type has you covered. Embrace innovation and efficiency with the CY8C4247AZI-L485 and experience the difference it can make in your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and impact resistance, making the product suitable for long-term use.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input, accommodating various voltage sources.

No. of Terminals: 64

High number of terminals enable extensive connectivity options and functionality.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme temperatures, ensuring reliability in different environments.

RAM Words: 8192

Large RAM capacity allows for efficient multitasking and processing of complex tasks.

Maximum Clock Frequency: 48 MHz

High clock frequency facilitates fast data processing and smooth operation.

Bus Compatibility: I2C; IRDA; LIN; SPI; UART; USB

Supports multiple bus protocols for versatile connectivity and communication options.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures resistance to moisture, enhancing product longevity and performance.

Technical Specifications

Multi-functional Peripherals CY8C4247AZI-L485 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

NO

Bus Compatibility:

I2C; IRDA; LIN; SPI; UART; USB

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

14.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

CY8C4247AZI-L485 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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