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STPCI2GDYC

STMicroelectronics

STPCI2GDYC by STMicroelectronics

STPCI2GDYC by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V and operates within -40 °C to 85°C. It features a 32-bit address bus and supports USB, PCI, ISA, and PCMCIA interfaces. Ideal for compact applications requiring efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,423

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-

-

-

Digiode

USA . 3,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,056

-

-

-

-

Anansix

USA . 1,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,691

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,140 parts In-Stock

1+ parts

$15.917

100+ parts

-

1k+ parts

-

10k+ parts

-

5,140

$15.917

-

-

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$51.490

100+ parts

-

1k+ parts

$46.341

10k+ parts

-

1,859

$51.490

-

$46.341

-

MKK Technologies

India . 1,409 parts In-Stock

1+ parts

$96.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,409

$96.823

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DigiPath Technology Company

USA . 1,409 parts In-Stock

1+ parts

$96.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,409

$96.823

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-

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Parana Technologies

USA . 2,134 parts In-Stock

1+ parts

-

100+ parts

$61.564

1k+ parts

-

10k+ parts

-

2,134

-

$61.564

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-

Corphita

USA . 1,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,982

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Overview

Unlock unparalleled performance with the STPCI2GDYC from STMicroelectronics, a premier choice in multi-functional peripherals. Known for its exceptional quality and reliability, this versatile product enhances your designs across various applications, from consumer electronics to industrial systems. Enjoy seamless integration, energy efficiency, and robust functionality that elevate your projects while reducing development time. Choose STMicroelectronics for innovation you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various settings.

Surface Mount: YES

Surface mount technology allows for a more compact design, which is essential for multi-functional peripherals, enhancing space efficiency.

Maximum Supply Voltage: 2.7 V

The maximum supply voltage of 2.7 V ensures compatibility with low-voltage applications, promoting energy efficiency.

Address Bus Width: 32

A 32-bit address bus width allows for accessing a larger memory range, which is beneficial for complex operations.

Package Shape: SQUARE

The square package shape provides uniformity and ease of layout in circuit design, which can simplify manufacturing.

No. of Terminals: 516

Having 516 terminals maximizes connectivity options, allowing for extensive interfacing capabilities with other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient mounting and excellent thermal management, contributing to the longevity and performance of the device.

Minimum Supply Voltage: 2.45 V

This low minimum supply voltage enhances energy efficiency, making this product suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for use in higher temperature environments, ensuring reliable performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows it to function in a variety of environments, making it versatile for different use cases.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates effective placement in compact designs, optimizing layout efficiency.

Maximum Seated Height: 2.38 mm

A maximum seated height of 2.38 mm promotes a low-profile design, aiding in space-saving applications in tight configurations.

Width: 35 mm

A width of 35 mm strikes a balance between a compact design and sufficient terminal accessibility, enhancing overall usability.

Boundary Scan: YES

Boundary scan capability enables quick and efficient testing, which streamlines the manufacturing process and enhances quality control.

External Data Bus Width: 32

A 32-bit external data bus width allows for fast data transfer rates, improving overall performance and user experience.

Maximum Clock Frequency: 14.31818 MHz

A maximum clock frequency of 14.31818 MHz supports high-speed operations, essential for responsive multi-functional peripherals.

Length: 35 mm

The 35 mm length, together with its width, maintains a compact form factor ideal for modern electronic designs.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: BALL

Ball terminal form enhances solderability and effective heat dissipation, crucial for device stability and performance.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V is optimal for minimizing power consumption while providing stable operation.

Bus Compatibility: USB; PCI; ISA; PCMCIA

Wide bus compatibility ensures versatile integration with various existing systems, expanding usability across multiple platforms.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for dense packing of components, which is essential in modern multi-functional peripheral designs.

No. of I/O Lines: 24

With 24 I/O lines, the product offers ample connectivity options, enabling extensive communication and functionality.

Technical Specifications

Multi-functional Peripherals STPCI2GDYC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA; PCMCIA

Maximum Clock Frequency:

14.31818 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2GDYC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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