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TDA2PHVRQACDQ1

Texas Instruments

TDA2PHVRQACDQ1 by Texas Instruments

TDA2PHVRQACDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 784 terminals in a low profile grid array package. Ideal for automotive applications, it operates b/w -40 to 125 °C with a max clock frequency of 38.4 MHz. Supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,080 parts In-Stock

1+ parts

-

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8,080

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Digiode

USA . 4,635 parts In-Stock

1+ parts

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4,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$5.829

100+ parts

-

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437

$5.829

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Parana Technologies

USA . 939 parts In-Stock

1+ parts

$14.834

100+ parts

-

1k+ parts

$15.263

10k+ parts

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939

$14.834

-

$15.263

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DigiPath Technology Company

USA . 1,312 parts In-Stock

1+ parts

$16.334

100+ parts

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1,312

$16.334

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ChromeModa Solutions

Germany . 4,043 parts In-Stock

1+ parts

$16.667

100+ parts

$13.667

1k+ parts

-

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4,043

$16.667

$13.667

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$16.667

100+ parts

$15.834

1k+ parts

$15.000

10k+ parts

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2,282

$16.667

$15.834

$15.000

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One Stop Electronics

USA . 218 parts In-Stock

1+ parts

$18.000

100+ parts

-

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218

$18.000

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Corohmni

South Africa . 616 parts In-Stock

1+ parts

$64.290

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616

$64.290

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Corphita

USA . 4,004 parts In-Stock

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4,004

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Overview

Elevate your automotive applications with the TDA2PHVRQACDQ1 by Texas Instruments. Designed with precision and reliability in mind, this multi-functional peripheral offers unparalleled performance and functionality. From its advanced technology to its robust construction, this product ensures seamless integration and optimal efficiency. Whether you're in the automotive industry or looking to enhance your electronic projects, the TDA2PHVRQACDQ1 delivers exceptional value and unmatched benefits to meet all your needs. Trust in Texas Instruments for quality products that push boundaries and exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, which is ideal for portable or frequently moved multi-functional peripherals.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures efficient power usage and helps in conserving energy, making the multi-functional peripheral environmentally friendly.

Address Bus Width: 16

The 16-bit address bus width allows for larger memory addressing capabilities, enabling the multi-functional peripheral to handle complex data processing tasks efficiently.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the multi-functional peripheral meets automotive industry standards for reliability and performance, making it suitable for use in automotive applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the multi-functional peripheral can withstand high levels of heat, ensuring reliable performance even in extreme conditions.

Technical Specifications

Multi-functional Peripherals TDA2PHVRQACDQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

784

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

TDA2PHVRQACDQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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