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TDA2EGADQABCRQ1

Texas Instruments

TDA2EGADQABCRQ1 by Texas Instruments

TDA2EGADQABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 38.4 MHz max clock frequency. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,209 parts In-Stock

1+ parts

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5,209

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Digiode

USA . 2,873 parts In-Stock

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2,873

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$12.260

100+ parts

-

1k+ parts

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752

$12.260

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One Stop Electronics

USA . 1,144 parts In-Stock

1+ parts

$16.000

100+ parts

-

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1,144

$16.000

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Parana Technologies

USA . 2,045 parts In-Stock

1+ parts

$55.823

100+ parts

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1k+ parts

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2,045

$55.823

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Corohmni

South Africa . 395 parts In-Stock

1+ parts

$57.783

100+ parts

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395

$57.783

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DigiPath Technology Company

USA . 146 parts In-Stock

1+ parts

$61.469

100+ parts

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146

$61.469

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ChromeModa Solutions

Germany . 2,269 parts In-Stock

1+ parts

$62.723

100+ parts

$51.433

1k+ parts

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10k+ parts

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2,269

$62.723

$51.433

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IDEA Electronic Components Group

UK . 451 parts In-Stock

1+ parts

$62.723

100+ parts

$59.587

1k+ parts

$56.451

10k+ parts

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451

$62.723

$59.587

$56.451

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Corphita

USA . 709 parts In-Stock

1+ parts

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709

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Overview

Experience the cutting-edge technology of the TDA2EGADQABCRQ1 by Texas Instruments, a game-changer in the world of multi-functional peripherals. Designed with precision and reliability in mind, this product offers unmatched performance in various automotive applications. With its innovative features and advanced capabilities, customers can expect seamless operations and enhanced efficiency. Elevate your projects with the superior quality and value that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand regular use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the product onto various devices or systems.

Maximum Supply Voltage: 1.2 V

With a maximum supply voltage of 1.2 V, the product is energy-efficient and can help lower overall power consumption.

Address Bus Width: 16

A larger address bus width of 16 allows for faster data transfer and processing, enhancing the performance of the product.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures that the product is suitable for use in automotive applications, where high reliability is crucial.

Package Shape: SQUARE

The square package shape makes the product easy to integrate into various electronic systems, optimizing space utilization.

No. of Terminals: 760

With a higher number of terminals, the product can support more connections and functionalities, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch package style allows for a compact design and efficient signal routing, improving overall performance.

Minimum Supply Voltage: 1.11 V

The minimum supply voltage of 1.11 V ensures stable operation even under low power conditions, making the product reliable in various scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to function effectively in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures the product can operate reliably in extreme cold conditions, expanding its usability range.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and resistance to corrosion, prolonging the product's lifespan.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for a clean and organized installation of the product, minimizing interference with other components.

Maximum Seated Height: 2.96 mm

The low maximum seated height of 2.96 mm enables a slim and compact form factor for the product, ideal for space-constrained applications.

RAM Words: 512K

With a larger RAM capacity of 512K words, the product can efficiently handle multitasking and data-intensive operations, enhancing overall performance.

Width: 23 mm

The compact width of 23 mm makes the product suitable for integration into small devices or systems, saving space and allowing for flexible placement.

Boundary Scan: YES

Having boundary scan capability enables advanced testing and diagnostic functions, simplifying maintenance and troubleshooting of the product.

External Data Bus Width: 32

A wider external data bus width of 32 bits allows for faster data transfer between the product and external devices, improving overall efficiency.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency of 38.4 MHz ensures quick processing and responsiveness, making the product suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures efficient and reliable soldering during assembly, enhancing product durability.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C allows for proper soldering of the product components, ensuring secure connections and long-term stability.

Length: 23 mm

The compact length of 23 mm contributes to a space-saving design for the product, making it suitable for tight layout constraints.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the product can withstand harsh operating conditions in vehicle environments, guaranteeing reliability and durability.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various applications.

Terminal Form: BALL

The ball terminal form provides secure connections and enables efficient heat dissipation, ensuring the product's longevity and stability during operation.

Nominal Supply Voltage: 1.15 V

With a nominal supply voltage of 1.15 V, the product achieves a balance between energy efficiency and performance, making it an ideal choice for various applications.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Supporting multiple bus interfaces like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB, the product offers versatile connectivity options for seamless integration with various systems.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for precise and reliable connections, ensuring optimal signal transmission and system performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is resistant to moisture-related damage, ensuring long-term reliability in humid or wet environments.

No. of I/O Lines: 215

The high number of I/O lines (215) enables versatile input and output capabilities, allowing the product to interface with various devices and peripherals efficiently.

Technical Specifications

Multi-functional Peripherals TDA2EGADQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

215

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

TDA2EGADQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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