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CY8C28243-24PVXIT

Infineon Technologies

CY8C28243-24PVXIT by Infineon Technologies

CY8C28243-24PVXIT by Infineon Technologies is an 8-bit MCU with 16384 ROM words and 1024 RAM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring multifunction peripherals. With a small outline package style and dual terminal position, it supports I2C, IRDA, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,445 parts In-Stock

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1,445

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Digiode

USA . 482 parts In-Stock

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482

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 1,418 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

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1,418

$4.000

$3.900

$3.880

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Ampacity Inc.

Singapore . 1,364 parts In-Stock

1+ parts

$6.000

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1,364

$6.000

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Aztec Data Supply Inc.

USA . 714 parts In-Stock

1+ parts

$15.719

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714

$15.719

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AZTECH Wire

Italy . 310 parts In-Stock

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$18.068

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310

$18.068

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Modulus Dynamics

Lithuania . 4,169 parts In-Stock

1+ parts

$24.868

100+ parts

$23.873

1k+ parts

$22.879

10k+ parts

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4,169

$24.868

$23.873

$22.879

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Corohmni

South Africa . 2,562 parts In-Stock

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$82.738

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$82.738

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Argo Parts USA

USA . 4,958 parts In-Stock

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4,958

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Continental Prestige Electronics

USA . 2,364 parts In-Stock

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2,364

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Corphita

USA . 617 parts In-Stock

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617

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock endless possibilities with the CY8C28243-24PVXIT by Infineon Technologies. Designed by a trusted manufacturer, this multi-functional peripheral offers unparalleled value and benefits. Ideal for a variety of applications, this versatile product boasts high-quality performance and reliability. Stay ahead of the curve with the CY8C28243-24PVXIT, your key to innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, suitable for portable devices.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power sources and compatibility with various systems.

Bit Size: 8

8-bit processing capability enables the device to handle a wide range of tasks efficiently.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability in different environmental conditions.

Bus Compatibility: I2C, IRDA, SPI, UART, USB

Support for multiple communication interfaces offers versatility for connecting to different devices and networks.

Technical Specifications

Multi-functional Peripherals CY8C28243-24PVXIT attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Bus Compatibility:

I2C, IRDA, SPI, UART, USB

CPU Family:

M8C

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

CY8C28243-24PVXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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