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ZPSD512B1-90JI

STMicroelectronics

ZPSD512B1-90JI by STMicroelectronics

ZPSD512B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85 °C. Its compact chip carrier design ensures efficient integration in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,291

-

-

-

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Vyrian

USA . 1,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,625

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-

-

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Anansix

USA . 886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

886

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$31.692

100+ parts

-

1k+ parts

$28.523

10k+ parts

-

560

$31.692

-

$28.523

-

MKK Technologies

India . 2,116 parts In-Stock

1+ parts

$59.595

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

$59.595

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-

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DigiPath Technology Company

USA . 2,116 parts In-Stock

1+ parts

$59.595

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

$59.595

-

-

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Corohmni

South Africa . 1,187 parts In-Stock

1+ parts

$71.348

100+ parts

-

1k+ parts

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10k+ parts

-

1,187

$71.348

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-

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Corphita

USA . 3,010 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,010

-

-

-

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Parana Technologies

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$37.893

1k+ parts

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10k+ parts

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490

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$37.893

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Overview

Elevate your designs with the ZPSD512B1-90JI from STMicroelectronics, a leader in innovative technology. This versatile multi-functional peripheral delivers exceptional reliability and efficiency across diverse applications, from automotive to industrial automation. With its robust performance and superior build quality, this product ensures long-lasting operation even in demanding environments, providing unmatched value that empowers your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and resistance to environmental factors, ensuring the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into various devices.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supplies, ensuring compatibility with various systems.

Address Bus Width: 16

The 16-bit address bus enhances memory addressing capabilities, enabling efficient data management.

Package Shape: SQUARE

The square package shape optimizes space usage on circuit boards, making it suitable for compact applications.

Power Supplies (V): 5

Standard 5V supply makes it convenient to integrate into most electronic devices.

No. of Terminals: 68

A higher number of terminals provides increased connectivity options, allowing multiple peripheral connections.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances heat dissipation and is designed for effective handling and placement.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement ensures stable operation across a variety of power supplies.

Maximum Operating Temperature: 85 °C

Operates reliably at elevated temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Withstands extreme cold, suitable for environments with harsh temperature variations.

Terminal Finish: TIN LEAD

The tin-lead finish ensures good solderability and reliable electrical connections.

Ultraviolet Erasable: N

While not UV erasable, the device provides robust data retention in environments where UV exposure is not an issue.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals, improving overall circuit performance.

Maximum Seated Height: 4.57 mm

The compact height facilitates placement in low-profile designs, enabling thinner devices.

RAM Words: 1024

Offers substantial RAM capacity for accommodating complex tasks and processes.

Width: 24.1808 mm

The optimized width allows for versatility in design and easy placement in various PCBs.

External Data Bus Width: 8

The 8-bit external data bus enables efficient data transfer rates for applications needing quick access.

Maximum Clock Frequency: 30 MHz

Support for high clock frequencies allows for faster processing speeds, improving overall performance.

Length: 24.1808 mm

The length aligns with standard PCB layouts, aiding in easy integration into existing systems.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for durability and long-term reliability in demanding applications.

ROM Bits Size: 512 Bits

Adequate ROM size for storing essential instructions, enhancing the functionality of the device.

Technology: CMOS

CMOS technology provides low power consumption, making it energy-efficient and suitable for portable devices.

Terminal Form: J BEND

J bend terminals ensure a secure connection to the PCB, providing stability during operation.

Nominal Supply Voltage: 5 V

Works ideally with a 5V nominal supply, simplifying power management in circuit designs.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility ensures seamless integration into various systems and legacy devices.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch allows for easy handling and placement on standard PCB layouts.

Maximum Standby Current: 0.00002 Amp

Ultra-low standby current consumption enhances energy efficiency, critical for battery-operated devices.

Maximum Access Time: 0.00000009 ns

Rapid access time facilitates high-speed data retrieval, ensuring quick response in applications.

No. of I/O Lines: 40

40 I/O lines provide ample connectivity options for interfacing with other devices and peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD512B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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