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ZPSD503B1-70JI

STMicroelectronics

ZPSD503B1-70JI by STMicroelectronics

ZPSD503B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz, ideal for industrial applications. With a compact chip carrier design, it supports various bus systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,979 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,979

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-

-

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Digiode

USA . 1,237 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,237

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Vyrian

USA . 860 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,126 parts In-Stock

1+ parts

$16.425

100+ parts

-

1k+ parts

$14.782

10k+ parts

-

1,126

$16.425

-

$14.782

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$19.180

100+ parts

-

1k+ parts

-

10k+ parts

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285

$19.180

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MKK Technologies

India . 2,299 parts In-Stock

1+ parts

$30.886

100+ parts

-

1k+ parts

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10k+ parts

-

2,299

$30.886

-

-

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DigiPath Technology Company

USA . 2,299 parts In-Stock

1+ parts

$30.886

100+ parts

-

1k+ parts

-

10k+ parts

-

2,299

$30.886

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-

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Corphita

USA . 4,036 parts In-Stock

1+ parts

-

100+ parts

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4,036

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Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

-

100+ parts

$19.638

1k+ parts

-

10k+ parts

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1,221

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$19.638

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Overview

Unlock unparalleled performance with the ZPSD503B1-70JI from STMicroelectronics, a leader in innovative multi-functional peripherals. This robust, surface-mount chip combines reliability and efficiency, making it ideal for industrial applications. With its wide operating temperature range and compatibility with major bus systems, it delivers seamless integration while enhancing your designs. Trust STMicroelectronics for quality that drives success, empowering you to achieve your project goals effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials in the package body ensures durability and low weight, making it suitable for various compact applications.

Surface Mount: YES

Surface mount technology allows for smaller devices and more efficient use of space on printed circuit boards, improving overall design flexibility.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of electronic devices and applications, enhancing versatility.

Address Bus Width: 16

With a 16-bit address bus width, this product can access a larger memory range, accommodating more complex functions and data handling.

Package Shape: SQUARE

The square package shape aids in space-efficient designs while providing stability and reliability during operation.

Power Supplies (V): 5

A nominal supply voltage of 5 V aligns with common electronic components, making it a convenient choice for integration into existing systems.

No. of Terminals: 68

A higher number of terminals (68) allows for more connectivity options, enhancing the peripheral's functionality and integration capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging facilitates easy handling and mounting onto circuit boards, minimizing potential damage during assembly.

Minimum Supply Voltage: 4.5 V

Operating at a minimum supply voltage of 4.5 V allows for flexibility in power supply design, accommodating varying voltage levels.

Maximum Operating Temperature: 85 °C

Support for high operating temperatures (up to 85 °C) makes this product suitable for industrial and demanding environments.

Minimum Operating Temperature: -40 °C

Its ability to function as low as -40 °C ensures reliability in extreme cold conditions, making it ideal for outdoor and harsh environment applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability, ensuring secure connections on PCBs and increasing product longevity.

Terminal Position: QUAD

Quad terminal positioning allows for easier access and enhanced layout in multilayer designs, promoting straightforward integration.

Maximum Seated Height: 4.57 mm

A low maximum seated height promotes a compact design profile, suitable for space-constrained applications.

RAM Words: 512

512 RAM words enable efficient temporary data storage, improving performance for multi-functional tasks and processing.

Width: 24.1808 mm

Its specific width facilitates standardization in design, fitting well within commonly used dimensions in multi-functional peripherals.

External Data Bus Width: 16

A 16-bit wide external data bus enhances data transfer rates and processing speed, making it more efficient for high-performance tasks.

Maximum Clock Frequency: 36 MHz

Operating at a maximum clock frequency of 36 MHz ensures high-speed applications and responsiveness, essential for modern multi-functional peripherals.

Length: 24.1808 mm

The specific length complements the width for efficient layout on circuit boards, facilitating compact design without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability in harsh conditions, making it suitable for industrial applications and long-term use.

ROM Bits Size: 1024 Bits

With 1024 bits of ROM, it offers substantial pre-programmed functionality, enhancing user experience without requiring additional firmware.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, optimizing performance for battery-operated devices.

Terminal Form: J BEND

J bend terminals simplify the PCB mounting process, ensuring secure connections while streamlining manufacturing.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronic systems, facilitating easy integration and compatibility.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility enhances flexibility in design and integration, allowing connection to various processors and systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for fine-pitch designs, suitable for high-density applications where space is at a premium.

Maximum Standby Current: 0.00002 Amp

Ultra-low maximum standby current ensures energy efficiency, extending battery life in portable applications.

Maximum Access Time: 0.00000007 ns

A very low maximum access time significantly improves system responsiveness, reducing latency in data retrieval.

No. of I/O Lines: 40

With 40 I/O lines, the product offers extensive interfacing capabilities, making it suitable for diverse applications in multi-functional peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD503B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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