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DRA790BAGCBDRQ1

Texas Instruments

DRA790BAGCBDRQ1 by Texas Instruments

DRA790BAGCBDRQ1 by Texas Instruments is a multi-functional peripheral with 538 terminals, 32-bit external data bus width, and 512K RAM words. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,128 parts In-Stock

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Digiode

USA . 1,519 parts In-Stock

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1,519

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Distributors (Availability)

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Native Components

USA . 16 parts In-Stock

1+ parts

$0.518

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16

$0.518

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Northwest PG Solutions

USA . 359 parts In-Stock

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$0.569

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359

$0.569

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AZTECH Wire

Italy . 626 parts In-Stock

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$10.485

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626

$10.485

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Parana Technologies

USA . 126 parts In-Stock

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$18.275

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$18.409

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126

$18.275

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$18.409

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DigiPath Technology Company

USA . 1,211 parts In-Stock

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$20.123

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$18.513

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$20.123

$18.513

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ChromeModa Solutions

Germany . 2,626 parts In-Stock

1+ parts

$20.534

100+ parts

$16.838

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2,626

$20.534

$16.838

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IDEA Electronic Components Group

UK . 1,011 parts In-Stock

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$20.534

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$19.507

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$18.481

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1,011

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Corohmni

South Africa . 5,121 parts In-Stock

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$21.536

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One Stop Electronics

USA . 144 parts In-Stock

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$29.000

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Corphita

USA . 2,446 parts In-Stock

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Microchip USA

USA . 1,877 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the DRA790BAGCBDRQ1 by Texas Instruments, a leading manufacturer in the industry. This multi-functional peripheral offers unmatched versatility and performance, making it perfect for a wide range of applications. From automotive to industrial, this product is designed to meet your specific needs. Trust in Texas Instruments to deliver cutting-edge technology that provides value and benefits to customers, ensuring seamless integration and optimal functionality. Elevate your projects with the DRA790BAGCBDRQ1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic systems.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures safe and efficient operation of the product.

Address Bus Width: 16

With a wide address bus width of 16, the product can handle large amounts of data efficiently.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that the product meets automotive quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact design, making the product space-saving and easy to integrate into various systems.

No. of Terminals: 538

The high number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures precise and reliable connections for optimal performance.

Minimum Supply Voltage: 1.11 V

The minimum supply voltage of 1.11 V ensures that the product can operate efficiently even at low power levels.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The product can operate effectively in extreme low temperature conditions down to -40°C.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures reliable electrical connections and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to connect the product to other components and systems.

Maximum Seated Height: 1.298 mm

The low maximum seated height of 1.298 mm allows for a slim and compact design of the product.

RAM Words: 512K

With a RAM capacity of 512K words, the product can efficiently store and process large amounts of data.

Width: 17 mm

The product's width of 17 mm makes it compact and suitable for applications where space is limited.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the product during development and production.

External Data Bus Width: 32

With an external data bus width of 32, the product can transfer data at high speeds and handle complex tasks efficiently.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency of 38.4 MHz ensures fast processing and response times for the product.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can be soldered using standard reflow processes.

Length: 17 mm

The product's length of 17 mm contributes to its compact and space-saving design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can operate reliably in automotive environments with varying temperature conditions.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: BALL

The ball terminal form provides secure connections and ensures stable performance of the product.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15 V ensures stable and consistent power supply for the product.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The product's compatibility with various bus protocols such as CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB allows for seamless integration into different systems and networks.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and compact layout of the product.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product is suitable for surface mount assembly and can withstand moderate exposure to moisture during handling and operation.

Speed: 300 rpm

With a speed of 300 rpm, the product can deliver fast and efficient performance in various applications.

No. of I/O Lines: 186

The high number of I/O lines provides versatile input and output options for connecting the product to external devices and systems.

Technical Specifications

Multi-functional Peripherals DRA790BAGCBDRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

186

No. of Terminals:

538

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

1.298 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DRA790BAGCBDRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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