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MIMX8UX6AVLFZAC

NXP Semiconductors

MIMX8UX6AVLFZAC by NXP Semiconductors

NXP Semiconductors' MIMX8UX6AVLFZAC is a multi-functional peripheral IC with 512K RAM, 24 MHz clock frequency, and CAN/SPI/UART compatibility. Ideal for automotive applications due to its CMOS technology, -40 to 125 °C operating temperature range, and 609 terminals in a grid array package.

Median Price

$94.835

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 362 parts In-Stock

1+ parts

$105.170

100+ parts

$80.635

1k+ parts

$78.624

10k+ parts

-

362

$105.170

$80.635

$78.624

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Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$105.170

100+ parts

$80.640

1k+ parts

-

10k+ parts

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6

$105.170

$80.640

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-

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$67.600

1k+ parts

$60.490

10k+ parts

$56.930

60

-

$67.600

$60.490

$56.930

Verical

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$84.500

1k+ parts

$75.612

10k+ parts

$71.162

30

-

$84.500

$75.612

$71.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,317 parts In-Stock

1+ parts

$65.018

100+ parts

-

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4,317

$65.018

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Vyrian

USA . 4,461 parts In-Stock

1+ parts

-

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4,461

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-

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Flip Electronics

USA . 3,000 parts In-Stock

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-

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3,000

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Anansix

USA . 2,713 parts In-Stock

1+ parts

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2,713

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$12.188

100+ parts

-

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496

$12.188

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-

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Aztec Data Supply Inc.

USA . 316 parts In-Stock

1+ parts

$24.530

100+ parts

-

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316

$24.530

-

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Corohmni

South Africa . 590 parts In-Stock

1+ parts

$58.196

100+ parts

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590

$58.196

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-

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Corphita

USA . 4,825 parts In-Stock

1+ parts

$61.596

100+ parts

-

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4,825

$61.596

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Semicontronic

India . 115 parts In-Stock

1+ parts

$63.840

100+ parts

$62.244

1k+ parts

$61.925

10k+ parts

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115

$63.840

$62.244

$61.925

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Ampacity Inc.

Singapore . 114 parts In-Stock

1+ parts

$63.840

100+ parts

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114

$63.840

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Microchip USA

USA . 1,827 parts In-Stock

1+ parts

$70.520

100+ parts

$70.520

1k+ parts

$70.520

10k+ parts

$70.520

1,827

$70.520

$70.520

$70.520

$70.520

UNI Independent Distributors

Spain . 7,900 parts In-Stock

1+ parts

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7,900

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Argo Parts USA

USA . 4,596 parts In-Stock

1+ parts

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4,596

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Continental Prestige Electronics

USA . 2,918 parts In-Stock

1+ parts

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100+ parts

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2,918

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

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Overview

Discover the cutting-edge MIMX8UX6AVLFZAC by NXP Semiconductors, a top-tier manufacturer renowned for its quality and innovation. This multi-functional peripherals device offers unparalleled performance and versatility, making it ideal for a wide range of applications. With advanced technology and reliable components, this product ensures seamless operation and exceptional results. Elevate your projects with the value, benefits, and advantages that only the MIMX8UX6AVLFZAC can deliver. Experience the difference today and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various environments and easy to handle.

Maximum Supply Voltage: 1.15 V

Allows for efficient power consumption while providing enough voltage for proper functionality.

Maximum Operating Temperature: 125 °C

Ability to withstand high temperatures ensures product reliability in demanding conditions.

RAM Words: 512K

Ample memory capacity enables the product to store and process large amounts of data efficiently.

Bus Compatibility: CAN(3), SAI(4), SPI(4), UART(6)

Support for multiple bus protocols enhances connectivity options and versatility of the product.

Technical Specifications

Multi-functional Peripherals MIMX8UX6AVLFZAC attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Boundary Scan:

YES

Bus Compatibility:

CAN(3), SAI(4), SPI(4), UART(6)

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e2

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

99

No. of Terminals:

609

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,35X35,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

512K

Maximum Seated Height:

2.52 mm

Maximum Supply Current:

5000 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MIMX8UX6AVLFZAC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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