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ZPSD512B0-70JI

STMicroelectronics

ZPSD512B0-70JI by STMicroelectronics

ZPSD512B0-70JI by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates at 5V. It supports multiple bus types, features a max clock frequency of 36 MHz, and functions in industrial applications from -40 °C to 85 °C. Its compact chip carrier design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,777 parts In-Stock

1+ parts

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4,777

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Digiode

USA . 3,972 parts In-Stock

1+ parts

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3,972

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Anansix

USA . 2,772 parts In-Stock

1+ parts

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2,772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$26.801

100+ parts

-

1k+ parts

$24.121

10k+ parts

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2,102

$26.801

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$24.121

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MKK Technologies

India . 671 parts In-Stock

1+ parts

$50.398

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671

$50.398

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DigiPath Technology Company

USA . 671 parts In-Stock

1+ parts

$50.398

100+ parts

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671

$50.398

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Corphita

USA . 4,080 parts In-Stock

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4,080

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Parana Technologies

USA . 1,867 parts In-Stock

1+ parts

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100+ parts

$32.045

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1,867

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$32.045

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Overview

Unlock unparalleled performance with the ZPSD512B0-70JI from STMicroelectronics, a trusted leader in high-quality multi-functional peripherals. Designed for robust applications in industrial settings, this versatile chip offers exceptional reliability and efficiency, operating seamlessly in extreme temperatures. Enhance your projects with its advanced features, ensuring optimal functionality while reducing time-to-market. Experience the superior value of STMicroelectronics—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protects the internal components from environmental factors, making this multi-functional peripheral reliable for industrial applications.

Surface Mount: YES

Surface mount technology allows for space-efficient placement on printed circuit boards, facilitating compact designs and improving manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product is compatible with a wide range of devices, making it versatile in various digital applications.

Address Bus Width: 16

A 16-bit address bus width allows for addressing a larger memory space, enhancing performance for complex computing tasks.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, contributing to more efficient designs in multi-functional applications.

No. of Terminals: 68

Having 68 terminals provides ample connection points for integration, allowing diverse functionality to be incorporated in a single device.

Package Style (Meter): CHIP CARRIER

The chip carrier style is suitable for high-density applications, enabling efficient use of board space while ensuring strong electrical connections.

Minimum Supply Voltage: 4.5 V

This product operates reliably even at a minimum supply voltage of 4.5 V, offering flexibility in power supply options.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this peripheral is suitable for various industrial environments where heat can be a concern.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40 °C ensures this product can be used in extreme conditions, increasing its applicability.

Terminal Position: QUAD

Quad terminal positions provide better routing flexibility in circuit designs, facilitating easier integration into diverse applications.

Maximum Seated Height: 4.57 mm

A low maximum seated height allows for compact design choices, making it suitable for space-constrained applications.

Width: 24.1808 mm

This specific width helps in compatibility with standard PCB layouts and ensures easy integration into existing systems.

External Data Bus Width: 8

An 8-bit external data bus width supports parallel data transfer, enhancing data throughput for faster processing.

Maximum Clock Frequency: 36 MHz

At a maximum clock frequency of 36 MHz, this device ensures high-speed operations, crucial for performance-intensive applications.

Length: 24.1808 mm

An exact length facilitates predictable integration into various hardware designs, thereby enhancing design reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that this product can withstand harsh operational environments, making it a dependable choice for industrial applications.

Technology: CMOS

CMOS technology allows for lower power consumption and increased operational speed, which is essential for modern electronic devices.

Terminal Form: J BEND

J-bend terminals facilitate easier handling and placement during the manufacturing process, enhancing overall production efficiency.

Nominal Supply Voltage: 5 V

Operating with a nominal supply voltage of 5 V aligns this product with common digital systems, enhancing compatibility.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility ensures this peripheral can integrate seamlessly with a variety of microcontroller and microprocessor architectures, increasing its versatility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard soldering techniques, making the assembly process easier and more efficient.

No. of I/O Lines: 40

With 40 I/O lines, this device supports extensive connectivity options, enabling the control of multiple peripherals or signals simultaneously.

Technical Specifications

Multi-functional Peripherals ZPSD512B0-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

ZPSD512B0-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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