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DRA726APGABCQ1

Texas Instruments

DRA726APGABCQ1 by Texas Instruments

DRA726APGABCQ1 by Texas Instruments is a multi-functional peripheral IC with 32-bit external data bus width, 512K RAM words, and 27 MHz max clock frequency. It is designed for automotive applications, featuring a CMOS technology, AEC-Q100 screening level, and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,434 parts In-Stock

1+ parts

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4,434

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Vyrian

USA . 2,523 parts In-Stock

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2,523

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Elcom Components

USA . 36 parts In-Stock

1+ parts

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$7.939

100+ parts

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428

$7.939

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Native Components

USA . 747 parts In-Stock

1+ parts

$9.683

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747

$9.683

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Northwest PG Solutions

USA . 1,123 parts In-Stock

1+ parts

$10.651

100+ parts

$9.586

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1,123

$10.651

$9.586

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One Stop Electronics

USA . 1,612 parts In-Stock

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$18.000

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1,612

$18.000

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Corohmni

South Africa . 392 parts In-Stock

1+ parts

$63.775

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392

$63.775

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Parana Technologies

USA . 761 parts In-Stock

1+ parts

$69.691

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761

$69.691

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DigiPath Technology Company

USA . 1,128 parts In-Stock

1+ parts

$76.738

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1,128

$76.738

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ChromeModa Solutions

Germany . 2,901 parts In-Stock

1+ parts

$78.304

100+ parts

$64.209

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2,901

$78.304

$64.209

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$78.304

100+ parts

$74.389

1k+ parts

$70.474

10k+ parts

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1,385

$78.304

$74.389

$70.474

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Corphita

USA . 4,494 parts In-Stock

1+ parts

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4,494

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Microchip USA

USA . 1,693 parts In-Stock

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1,693

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Overview

Experience unparalleled quality and performance with the DRA726APGABCQ1 by Texas Instruments. As a leader in innovation, Texas Instruments delivers cutting-edge solutions for multi-functional peripherals that excel in various applications. This product stands out with its high value, offering customers exceptional benefits and advantages. From automotive to industrial sectors, this device provides reliability and efficiency that surpasses expectations. Trust Texas Instruments for top-notch technology that drives success in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.2 V

Provides stable power supply to the device, ensuring consistent performance.

Address Bus Width: 16

Allows for efficient communication within the device, supporting complex operations and tasks.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability and performance in harsh operating conditions.

Package Shape: SQUARE

Optimal shape for space-saving design and efficient component placement.

No. of Terminals: 760

Provides ample connectivity options for various peripherals and external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high-density mounting, reducing overall footprint and enhancing integration capabilities.

Minimum Supply Voltage: 1.11 V

Ensures operational stability even under low power conditions, increasing reliability.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Operates effectively in extreme cold conditions, ensuring consistent performance in all environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Facilitates easy and secure attachment to circuit boards, enhancing overall product stability.

Maximum Seated Height: 2.96 mm

Low profile design for compact and slim product form factor.

RAM Words: 512K

Sufficient memory capacity for multitasking and processing complex data sets efficiently.

Width: 23 mm

Compact size for easy integration into various devices and systems.

Boundary Scan: YES

Facilitates testing and debugging processes, ensuring product quality and reliability.

External Data Bus Width: 32

Increased data transfer capabilities for faster performance and enhanced functionality.

Maximum Clock Frequency: 27 MHz

High clock frequency for quick and responsive operations, improving overall user experience.

Maximum Time At Peak Reflow Temperature (s): 30

Precise reflow temperature control for safe and efficient soldering processes.

Peak Reflow Temperature °C: 250

Can withstand high temperature reflow soldering, ensuring robust assembly quality.

Length: 23 mm

Compact size for space-saving design and easy integration into various products.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in vehicle applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Specialized microprocessor design for efficient and optimized processing of data and instructions.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation, enhancing energy efficiency.

Terminal Form: BALL

Ball terminal form for secure and reliable connections, ensuring stable performance.

Nominal Supply Voltage: 1.15 V

Optimal supply voltage for efficient and stable operation of the device.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Support for various communication protocols, enabling seamless integration with different devices and systems.

Terminal Pitch: 0.8 mm

Fine pitch for high-density mounting and efficient PCB layout, optimizing space usage.

Format: FIXED POINT

Fixed-point format for precise arithmetic calculations and efficient data processing.

Moisture Sensitivity Level (MSL): 3

MSL rating ensures safe storage and handling of the product to prevent moisture-related damage.

Speed: 1500 rpm

High rotational speed for improved processing performance and responsiveness.

Low Power Mode: YES

Energy-saving mode for reduced power consumption during idle or low-load operation.

No. of I/O Lines: 215

Ample I/O lines for versatile connectivity options and external device integration.

Technical Specifications

Multi-functional Peripherals DRA726APGABCQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

215

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DRA726APGABCQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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