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3530ECUSAGRM

Texas Instruments

3530ECUSAGRM by Texas Instruments

Texas Instruments 3530ECUSAGRM is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring low power mode and compatibility with CAN, I2C, IRDA, PCI, SPI, UART, USB buses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,982 parts In-Stock

1+ parts

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6,982

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Digiode

USA . 2,588 parts In-Stock

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-

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2,588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$16.056

100+ parts

-

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286

$16.056

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$22.080

100+ parts

$20.093

1k+ parts

$18.106

10k+ parts

-

3,000

$22.080

$20.093

$18.106

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One Stop Electronics

USA . 1,342 parts In-Stock

1+ parts

$29.000

100+ parts

-

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1,342

$29.000

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Corohmni

South Africa . 159 parts In-Stock

1+ parts

$58.714

100+ parts

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159

$58.714

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Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

$59.337

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1,287

$59.337

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ChromeModa Solutions

Germany . 3,403 parts In-Stock

1+ parts

$66.671

100+ parts

$54.670

1k+ parts

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3,403

$66.671

$54.670

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$66.671

100+ parts

$63.337

1k+ parts

$60.004

10k+ parts

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1,212

$66.671

$63.337

$60.004

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DigiPath Technology Company

USA . 1,950 parts In-Stock

1+ parts

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100+ parts

$60.111

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1,950

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$60.111

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Corphita

USA . 794 parts In-Stock

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794

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Native Components

USA . 528 parts In-Stock

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528

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Northwest PG Solutions

USA . 159 parts In-Stock

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159

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Overview

Experience peak performance with the Texas Instruments 3530ECUSAGRM multi-functional peripheral. Crafted with precision and expertise by a trusted industry leader, this innovative device offers unparalleled speed and efficiency for a wide range of applications. Whether you're looking to enhance your productivity at work or streamline your home entertainment system, this product delivers unmatched value and reliability. Say goodbye to slow processing speeds and hello to seamless functionality with the Texas Instruments 3530ECUSAGRM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and strength, making the product sturdy and long-lasting.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the device by providing quicker access to frequently used data.

Maximum Supply Voltage: 1.4175 V

With a higher maximum supply voltage, the device can handle power fluctuations effectively without getting damaged.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature makes this product suitable for use in various environments, including extreme cold conditions.

Maximum Clock Frequency: 38.4 MHz

The high clock frequency allows for faster data processing and smoother operation of the device.

Bus Compatibility: CAN; I2C; IRDA; PCI; SPI; UART; USB

The wide range of bus compatibility ensures seamless connectivity with other devices and systems, enhancing the versatility of the product.

Technical Specifications

Multi-functional Peripherals 3530ECUSAGRM attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

26

Boundary Scan:

YES

Bus Compatibility:

CAN; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

188

No. of Terminals:

423

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

64K

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.4175 V

Minimum Supply Voltage:

1.2825 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

3530ECUSAGRM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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