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3530ECBCAMERCURY

Texas Instruments

3530ECBCAMERCURY by Texas Instruments

Texas Instruments 3530ECBCAMERCURY is a multi-functional peripheral with integrated cache and 64K RAM words. Featuring a max clock frequency of 38.4 MHz, it is ideal for industrial applications requiring high-speed processing. With compatibility for various bus types like CAN, I2C, and USB, this microprocessor offers versatile connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,056 parts In-Stock

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7,056

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Digiode

USA . 2,753 parts In-Stock

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2,753

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Distributors (Availability)

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$14.930

100+ parts

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884

$14.930

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Parana Technologies

USA . 1,811 parts In-Stock

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$26.375

100+ parts

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$26.970

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1,811

$26.375

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$26.970

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DigiPath Technology Company

USA . 449 parts In-Stock

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$29.042

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449

$29.042

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ChromeModa Solutions

Germany . 1,032 parts In-Stock

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$29.635

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$24.301

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1,032

$29.635

$24.301

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IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$29.635

100+ parts

$28.153

1k+ parts

$26.672

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778

$29.635

$28.153

$26.672

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One Stop Electronics

USA . 796 parts In-Stock

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$30.000

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796

$30.000

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Corohmni

South Africa . 2,512 parts In-Stock

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$46.962

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$46.962

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Corphita

USA . 2,300 parts In-Stock

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2,300

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Northwest PG Solutions

USA . 843 parts In-Stock

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843

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Native Components

USA . 446 parts In-Stock

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Microchip USA

USA . 267 parts In-Stock

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Overview

Enhance your electronic projects with the cutting-edge 3530ECBCAMERCURY by Texas Instruments. This product, crafted by the renowned manufacturer TI, falls under the Multi-functional Peripherals category, ensuring versatility and top-notch performance. With features like integrated cache and a wide array of bus compatibility options, this device offers unmatched value to customers looking for excellence in their designs. Elevate your creations with this high-quality product and experience the innovation and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portability and long-term use.

Integrated Cache: YES

Having integrated cache improves processing speed and efficiency for multitasking and handling complex operations.

Maximum Supply Voltage: 1.4175 V

The higher maximum supply voltage allows for more power to be supplied, which can enhance performance and capabilities of the device.

Address Bus Width: 26

With a wider address bus width, the device can efficiently handle larger memory addresses and data transfers.

Package Shape: SQUARE

The square package shape allows for compact and efficient placement within the device, optimizing space usage.

No. of Terminals: 515

Having a high number of terminals allows for versatile connectivity options and integration with various peripherals.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures stability and reliability even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the device can function in a wide range of environments, including low temperature settings.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of a RISC microprocessor enhances processing efficiency and speed, making the device suitable for handling multiple functions smoothly.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and stable operation.

Technical Specifications

Multi-functional Peripherals 3530ECBCAMERCURY attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

26

Boundary Scan:

YES

Bus Compatibility:

CAN; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

188

No. of Terminals:

515

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

64K

Maximum Seated Height:

1 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.4175 V

Minimum Supply Voltage:

1.2825 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

3530ECBCAMERCURY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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