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ZPSD513B1-70U

STMicroelectronics

ZPSD513B1-70U by STMicroelectronics

ZPSD513B1-70U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and is ideal for embedded systems. Its compact flatpack design ensures efficient space utilization in applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,834 parts In-Stock

1+ parts

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3,834

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Anansix

USA . 1,023 parts In-Stock

1+ parts

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1,023

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Vyrian

USA . 269 parts In-Stock

1+ parts

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 519 parts In-Stock

1+ parts

$15.382

100+ parts

-

1k+ parts

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10k+ parts

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519

$15.382

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IDEA Electronic Components Group

UK . 354 parts In-Stock

1+ parts

$66.355

100+ parts

-

1k+ parts

$59.720

10k+ parts

-

354

$66.355

-

$59.720

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MKK Technologies

India . 2,377 parts In-Stock

1+ parts

$124.776

100+ parts

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2,377

$124.776

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DigiPath Technology Company

USA . 2,377 parts In-Stock

1+ parts

$124.776

100+ parts

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2,377

$124.776

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Parana Technologies

USA . 1,158 parts In-Stock

1+ parts

-

100+ parts

$79.338

1k+ parts

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1,158

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$79.338

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Corphita

USA . 283 parts In-Stock

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283

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Overview

Unlock unparalleled performance with the ZPSD513B1-70U from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral is designed for seamless integration in diverse applications, offering robustness and reliability that enhance your projects. With its low profile design and efficient power supply capabilities, it delivers exceptional value, making it the perfect choice for cutting-edge electronics while ensuring optimal operation in demanding environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures structural integrity and resistance to environmental factors, offering enhanced longevity.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing, making this product ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V ensures compatibility with a wide range of devices, providing flexibility in application.

Address Bus Width: 16

A 16-bit address bus width allows for accessing a larger memory space, enhancing the device's capability to handle complex tasks.

Package Shape: SQUARE

The square package shape optimizes space utilization on circuit boards, which is beneficial in compact device designs.

Power Supplies (V): 5

Operating at a common 5V power supply makes integration simpler and reduces the design constraints for developers.

No. of Terminals: 80

Having 80 terminals provides extensive connectivity options for complex applications and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design contributes to space-saving and enables a sleek overall device design.

Minimum Supply Voltage: 4.5 V

Operating effectively down to 4.5V allows for greater versatility in varying power supply conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is reliable in industrial and high-heat environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in a broader range of conditions.

Terminal Finish: TIN LEAD

The tin lead finish offers good solderability and reduces the risk of corrosion over time.

Ultraviolet Erasable: N

The absence of ultraviolet erasability may result in improved data retention, making it suitable for stable applications.

Terminal Position: QUAD

Quad terminal positioning aids in ease of assembly and reduces footprint on the PCB.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6 mm keeps the component close to the PCB surface, beneficial for high-density designs.

RAM Words: 1024

1024 RAM words allow for efficient data handling and processing capabilities in computations or data storage.

Width: 14 mm

A compact width of 14 mm helps in fitting into tight spaces while maintaining performance.

External Data Bus Width: 8

An 8-bit external data bus width facilitates simple communication with other devices, enhancing interoperability.

Maximum Clock Frequency: 50 MHz

A maximum clock frequency of 50 MHz allows for high-speed operation suitable for demanding applications.

Length: 14 mm

The length of 14 mm complements its width for an efficient overall compact design.

Temperature Grade: COMMERCIAL

Commercial temperature rating ensures reliability for various consumer electronics applications.

ROM Bits Size: 1024 Bits

1024 bits of ROM provide a reasonable amount of program storage, making it suitable for applications needing modest code size.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form allows for reliable soldering and easy inspection, streamlining the manufacturing process.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with industry standards, promoting compatibility with existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures that this product can be integrated into a variety of legacy and modern systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm helps in minimizing space without compromising connectivity, ideal for compact designs.

Maximum Standby Current: 0.00002 Amp

Minimizing standby current enhances energy efficiency, particularly beneficial in battery-operated designs.

Maximum Access Time: 0.00000007 ns

Ultra-low access time indicates fast data retrieval capabilities, improving overall performance in time-critical applications.

No. of I/O Lines: 40

With 40 I/O lines, this product can handle numerous inputs and outputs, providing versatility for a wide range of applications.

Technical Specifications

Multi-functional Peripherals ZPSD513B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD513B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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