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STPCI2EEYC

STMicroelectronics

STPCI2EEYC by STMicroelectronics

STPCI2EEYC by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V, supporting USB and PCI bus compatibility. It features a 32-bit address bus width and operates at temperatures from 0 °C to 70°C. Ideal for compact applications, it comes in a square grid array package with 516 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Vyrian

USA . 1,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,634

-

-

-

-

Digiode

USA . 171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

171

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 31 parts In-Stock

1+ parts

$26.802

100+ parts

-

1k+ parts

-

10k+ parts

-

31

$26.802

-

-

-

IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$35.376

100+ parts

-

1k+ parts

$31.838

10k+ parts

-

1,556

$35.376

-

$31.838

-

MKK Technologies

India . 280 parts In-Stock

1+ parts

$66.522

100+ parts

-

1k+ parts

-

10k+ parts

-

280

$66.522

-

-

-

DigiPath Technology Company

USA . 280 parts In-Stock

1+ parts

$66.522

100+ parts

-

1k+ parts

-

10k+ parts

-

280

$66.522

-

-

-

Corphita

USA . 1,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,697

-

-

-

-

Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

$42.297

1k+ parts

-

10k+ parts

-

1,640

-

$42.297

-

-

Overview

Unlock a world of possibilities with the STPCI2EEYC from STMicroelectronics, where cutting-edge technology meets unmatched reliability. This versatile multi-functional peripheral is designed to enhance your applications, providing seamless integration across USB, PCI, and ISA interfaces. With its compact design and robust performance, it ensures efficient operation in diverse environments. Choose STMicroelectronics for superior quality and innovation that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic and epoxy material ensures robustness and reliability in various operational environments.

Surface Mount: YES

Surface mount compatibility allows for efficient use of board space and facilitates automated assembly processes.

Maximum Supply Voltage: 2.7 V

A maximum supply voltage of 2.7 V ensures compatibility with a wide range of low-power applications.

Address Bus Width: 32

The 32-bit address bus width provides ample addressing capability, making it suitable for high-performance applications.

Package Shape: SQUARE

The square package shape offers a balanced layout for improved thermal and electrical performance.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages allows seamless integration into diverse electronic systems.

No. of Terminals: 516

A high number of terminals enhances connectivity options, offering flexibility for complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array packaging provides improved electrical performance and helps in efficient heat dissipation.

Minimum Supply Voltage: 2.45 V

The minimum supply voltage of 2.45 V enables operation in lower-power scenarios, making it energy-efficient.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for use in demanding environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable functionality in standard operating conditions.

Terminal Finish: TIN LEAD

The tin-lead finish promotes excellent solderability and durability in connections.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes board layout and thermal management.

Maximum Seated Height: 2.38 mm

A compact seated height facilitates lower-profile designs, saving space in assemblies.

Width: 35 mm

A width of 35 mm provides a balanced footprint for versatile applications in various devices.

Boundary Scan: YES

Incorporating boundary scan capabilities enhances testing and debugging, ensuring product reliability.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer, improving overall system performance.

Maximum Clock Frequency: 14.318 MHz

The high maximum clock frequency supports fast operations, catering to performance-intensive applications.

Length: 35 mm

With a 35 mm length, this product strikes a balance between compact size and ample connectivity options.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for general-purpose usage across various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high scalability, ideal for modern electronic designs.

Terminal Form: BALL

Ball terminal form improves solder joint reliability and simplifies layout design on PCBs.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V reflects its suitability for low-power applications.

Bus Compatibility: USB; PCI; ISA

Broad bus compatibility ensures integration with various systems and enhanced device interoperability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density packaging while maintaining easy soldering and connection.

No. of I/O Lines: 24

24 I/O lines provide substantial connectivity options, making it versatile for diverse applications.

Technical Specifications

Multi-functional Peripherals STPCI2EEYC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2EEYC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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