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LPC47M112-MW

Microchip Technology

LPC47M112-MW by Microchip Technology

LPC47M112-MW by Microchip Technology is a Multi-functional Peripheral IC with 256 RAM words. It operates b/w 0-70 °C and supports IRDA, PC-AT, PC-XT, PS/2, PCI bus compatibility. This CMOS technology chip has 45 I/O lines and requires a supply voltage of 2.97-3.63 V for various applications.

Median Price

$6.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 21 parts In-Stock

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-

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$6.600

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$6.111

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21

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$6.600

$6.111

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Distributors (In-Stock)

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Vyrian

USA . 5,658 parts In-Stock

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-

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5,658

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Chip Stock

USA . 705 parts In-Stock

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705

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Cyclops Electronics Ltd

UK . 660 parts In-Stock

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660

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Vigor

Singapore . 1,660 parts In-Stock

1+ parts

$6.760

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1,660

$6.760

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Corohmni

South Africa . 997 parts In-Stock

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$26.944

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997

$26.944

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Marpe Global Electronics

Taiwan . 6,045 parts In-Stock

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6,045

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QualityLine Systems

Poland . 6,045 parts In-Stock

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6,045

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XL Components Corporation

Australia . 6,045 parts In-Stock

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6,045

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Kepictronics

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,528 parts In-Stock

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3,528

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Argo Parts USA

USA . 2,933 parts In-Stock

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2,933

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

USA . 235 parts In-Stock

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235

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Overview

Experience the next level of performance with the LPC47M112-MW by Microchip Technology. As a leader in the industry, Microchip guarantees unmatched quality and reliability in their products. The LPC47M112-MW is a versatile Multi-functional Peripherals device that offers a wide range of applications, making it an essential component for various projects. With its cutting-edge technology, this product ensures seamless integration and exceptional performance, providing customers with unbeatable value and benefits. Upgrade your systems with the LPC47M112-MW and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, making the product easy to handle and transport.

Maximum Supply Voltage: 3.63 V

Provides flexibility in powering the device within a safe voltage range.

No. of Terminals: 100

Sufficient number of terminals for multiple input and output connections, enhancing versatility.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, ensuring reliability in various environments.

RAM Words: 256

Adequate RAM capacity for efficient processing and storage of data.

Technology: CMOS

Uses CMOS technology for low power consumption and high speed performance.

No. of Serial I/Os: 2

Multiple serial I/Os for connecting to different devices, increasing connectivity options.

Bus Compatibility: IRDA, PC-AT, PC-XT, PS/2, PCI

Wide range of bus compatibility for seamless integration with various computer systems.

Technical Specifications

Multi-functional Peripherals LPC47M112-MW attributes and parameters. Explore more Multi-functional Peripherals devices from Microchip Technology

Specs

Boundary Scan:

NO

Bus Compatibility:

IRDA, PC-AT, PC-XT, PS/2, PCI

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e3

Length:

20 mm

No. of I/O Lines:

45

No. of Serial I/Os:

2

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.55X0.79

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

RAM Words:

256

Screening Level:

TS 16949

Maximum Seated Height:

3.4 mm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC47M112-MW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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