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AF82801IBM

Intel

AF82801IBM by Intel

Intel's AF82801IBM is a multi-functional peripheral with 676 terminals in a grid array package. It features CMOS technology and supports PCI, USB, and LPC buses. Ideal for applications requiring versatile connectivity in a compact square-shaped plastic/epoxy body with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 173 parts In-Stock

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173

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Vyrian

USA . 171 parts In-Stock

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171

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VNN

France . 90 parts In-Stock

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90

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Nova Conductors

Japan . 55 parts In-Stock

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Andel Nordic

Denmark . 3,797 parts In-Stock

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$3.674

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$3.527

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$3.527

3,797

$3.674

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$3.527

$3.527

MARBEL Systems

Belgium . 5,440 parts In-Stock

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$17.207

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$17.207

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Texas Native Microelectronics

USA . 2,328 parts In-Stock

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$19.778

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$18.394

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$17.405

2,328

$19.778

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$18.394

$17.405

Kenton Components

USA . 500 parts In-Stock

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$23.734

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$20.886

500

$23.734

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$20.886

Ampacity Inc.

Singapore . 832 parts In-Stock

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$25.000

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832

$25.000

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Qasali Group International

UK . 2,239 parts In-Stock

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$53.401

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$53.401

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Corohmni

South Africa . 4 parts In-Stock

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$83.978

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Lixinc

USA . 14,473 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,045 parts In-Stock

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Continental Prestige Electronics

USA . 4,104 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,363 parts In-Stock

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Argo Parts USA

USA . 2,105 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corphita

USA . 196 parts In-Stock

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196

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GreenTree Electronics

Israel . 150 parts In-Stock

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Kepictronics

USA . 130 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Upgrade your system with the cutting-edge AF82801IBM by Intel, a top-of-the-line multi-functional peripheral designed for seamless integration and enhanced performance. Crafted with precision by Intel, this innovative product boasts superior quality and reliability to meet all your computing needs. Whether you're looking to boost your PCI, USB, or LPC bus compatibility, this versatile device has you covered. Say goodbye to slow loading times and hello to a smoother, more efficient experience. Trust Intel to deliver excellence in technology - experience the difference today with the AF82801IBM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to wear and tear, ensuring longevity of the product.

Surface Mount: YES

Surface mount technology makes the product lightweight and compact, ideal for space-saving installations.

Package Shape: SQUARE

Square shape allows for easy integration into existing setups and provides a uniform appearance.

No. of Terminals: 676

High number of terminals enables strong connectivity and compatibility with multiple devices.

Package Style: GRID ARRAY

Grid array package style ensures efficient heat dissipation and optimal circuit performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and maintenance of the product.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for improved efficiency.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable data transmission.

Bus Compatibility: PCI; USB; LPC

Compatible with multiple bus interfaces, allowing for versatile connectivity and seamless integration with various systems.

Technical Specifications

Multi-functional Peripherals AF82801IBM attributes and parameters. Explore more Multi-functional Peripherals devices from Intel

Specs

Boundary Scan:

NO

Bus Compatibility:

PCI; USB; LPC

JESD-30 Code:

S-PBGA-B676

No. of Terminals:

676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

AF82801IBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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