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ZPSD513B1-15LI

STMicroelectronics

ZPSD513B1-15LI by STMicroelectronics

ZPSD513B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a max clock frequency of 34.48 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,385 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,385

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Anansix

USA . 1,643 parts In-Stock

1+ parts

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1k+ parts

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1,643

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Vyrian

USA . 1,040 parts In-Stock

1+ parts

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1,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,959 parts In-Stock

1+ parts

$51.572

100+ parts

-

1k+ parts

-

10k+ parts

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1,959

$51.572

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IDEA Electronic Components Group

UK . 2,243 parts In-Stock

1+ parts

$67.783

100+ parts

-

1k+ parts

$61.005

10k+ parts

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2,243

$67.783

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$61.005

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MKK Technologies

India . 2,246 parts In-Stock

1+ parts

$127.461

100+ parts

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10k+ parts

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2,246

$127.461

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DigiPath Technology Company

USA . 2,246 parts In-Stock

1+ parts

$127.461

100+ parts

-

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10k+ parts

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2,246

$127.461

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Corphita

USA . 3,534 parts In-Stock

1+ parts

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3,534

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Parana Technologies

USA . 692 parts In-Stock

1+ parts

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100+ parts

$81.045

1k+ parts

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692

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$81.045

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Overview

Elevate your designs with the ZPSD513B1-15LI from STMicroelectronics—a powerhouse in multi-functional peripherals. Crafted with precision and reliability, this innovative component offers exceptional performance for demanding industrial applications. With its robust build and compatibility across various platforms, it ensures seamless integration and longevity. Trust in STMicroelectronics’ legacy of quality to unlock new potential in your projects, delivering unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed cofire package ensures robust protection against environmental factors, enhancing reliability in various settings.

Surface Mount: YES

Surface mount technology allows for compact design and improved circuit density, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, it offers flexibility in power supply requirements while maintaining safe operating limits.

Address Bus Width: 16

The 16-bit address bus width supports extensive addressing options, allowing the device to manage larger memory requirements effectively.

Package Shape: SQUARE

The square package shape provides symmetrical design, making it easier to fit into various layouts and designs.

Power Supplies (V): 5

A standard 5V supply requirement simplifies integration into existing systems, without the need for specialized power supplies.

No. of Terminals: 68

With 68 terminals, this device offers a variety of connection options, making it versatile for numerous applications.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window allows for easy optical inspection and better thermal management for high-performance applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures energy efficiency and broader compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this device suitable for use in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device is capable of functioning in extreme cold, enhancing its application range.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and reliability for stable connections on PCBs.

Ultraviolet Erasable: YES

Ultraviolet erasure capability allows for easy reprogramming of the device, making it highly adaptable for various tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout options and effective usage of board space.

Maximum Seated Height: 4.57 mm

A low maximum seated height allows for compact designs, making it suitable for space-constrained applications.

RAM Words: 1024

With 1024 RAM words, this product offers ample memory for data processing, enhancing performance for complex tasks.

Width: 24.105 mm

The 24.105 mm width is ideal for standard PCB designs, ensuring compatibility with a wide range of components.

External Data Bus Width: 8

The 8-bit external data bus width allows efficient data transfer, ensuring smooth operation for applications requiring fast data access.

Maximum Clock Frequency: 34.48 MHz

A high maximum clock frequency of 34.48 MHz translates to fast processing speeds, suitable for high-performance applications.

Length: 24.105 mm

Matching the width, the length of 24.105 mm maintains consistent dimensions for organized board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and performance in challenging conditions, making it suitable for industrial applications.

ROM Bits Size: 1024 Bits

1024 bits of ROM allows for sufficient storage of firmware and essential data, supporting efficient operation.

Technology: CMOS

CMOS technology is known for its low power consumption, making this device energy-efficient for battery-powered applications.

Terminal Form: J BEND

The J bend terminal form allows for secure mounting on PCBs, enhancing the stability of the device during operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard for electronic components, ensuring compatibility with a wide range of devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad compatibility with numerous bus architectures makes this product versatile and easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates careful spacing for soldering, ensuring high reliability in connections.

Maximum Standby Current: 0.00002 Amp

With a very low maximum standby current, the device minimizes power consumption when idle, promoting energy efficiency.

Maximum Access Time: 0.00000015 ns

Extremely fast access time improves overall system performance, allowing quick data retrieval and processing.

No. of I/O Lines: 40

Having 40 I/O lines allows for comprehensive input/output operations, making it suitable for complex interfacing needs.

Technical Specifications

Multi-functional Peripherals ZPSD513B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD513B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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