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XDRA756PPIGABZ

Texas Instruments

XDRA756PPIGABZ by Texas Instruments

XDRA756PPIGABZ by Texas Instruments is a multi-functional peripheral with 32-bit address bus width and 64-bit external data bus width. It operates at a max clock frequency of 38.4 MHz, making it suitable for automotive applications requiring high-speed data processing. With a package style of grid array and low profile, this device offers 2.5M RAM words and is compatible with various bus interfaces such as CAN, Ethernet, I2C, SPI, UART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,201 parts In-Stock

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4,201

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Digiode

USA . 2,815 parts In-Stock

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2,815

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Distributors (Availability)

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$10.768

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225

$10.768

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One Stop Electronics

USA . 864 parts In-Stock

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$17.000

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864

$17.000

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Parana Technologies

USA . 827 parts In-Stock

1+ parts

$45.808

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827

$45.808

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$50.441

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588

$50.441

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ChromeModa Solutions

Germany . 1,309 parts In-Stock

1+ parts

$51.470

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$42.205

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1,309

$51.470

$42.205

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IDEA Electronic Components Group

UK . 711 parts In-Stock

1+ parts

$51.470

100+ parts

$48.896

1k+ parts

$46.323

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711

$51.470

$48.896

$46.323

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Corohmni

South Africa . 909 parts In-Stock

1+ parts

$52.178

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909

$52.178

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Corphita

USA . 1,224 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the XDRA756PPIGABZ by industry-leading manufacturer Texas Instruments. This cutting-edge multi-functional peripheral offers a wide range of applications, making it a versatile solution for all your electronic needs. With advanced technology and top-notch quality, this product delivers exceptional value and benefits to customers seeking seamless integration and high efficiency in their projects. Upgrade to the XDRA756PPIGABZ today and take your electronics to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and maintain.

Maximum Supply Voltage: 1.2 V

Operating within a safe voltage range ensures the longevity and safety of the product.

Surface Mount: YES

Surface mount technology allows for compact design and efficient PCB assembly.

RAM Words: 2.5M

With a large RAM capacity, the product can handle complex tasks and store a significant amount of data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Maximum Clock Frequency: 38.4 MHz

A high clock frequency allows for fast processing speeds, making the product suitable for demanding applications.

Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB

Support for multiple bus protocols enhances the product's connectivity and versatility, enabling it to interact with various devices and systems.

Technical Specifications

Multi-functional Peripherals XDRA756PPIGABZ attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B760

Length:

23 mm

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

XDRA756PPIGABZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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