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ZPSD502B1-70U

STMicroelectronics

ZPSD502B1-70U by STMicroelectronics

ZPSD502B1-70U by STMicroelectronics is a versatile 80-terminal CMOS peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It supports multiple bus types, making it ideal for embedded systems. With a max clock frequency of 50 MHz, it's perfect for high-speed applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,544 parts In-Stock

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2,544

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Anansix

USA . 2,350 parts In-Stock

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2,350

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Vyrian

USA . 476 parts In-Stock

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476

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Distributors (Availability)

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Corohmni

South Africa . 2,689 parts In-Stock

1+ parts

$27.529

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2,689

$27.529

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$65.850

100+ parts

-

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$59.265

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1,982

$65.850

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$59.265

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MKK Technologies

India . 553 parts In-Stock

1+ parts

$123.826

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553

$123.826

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DigiPath Technology Company

USA . 553 parts In-Stock

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$123.826

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553

$123.826

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Corphita

USA . 3,945 parts In-Stock

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3,945

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Parana Technologies

USA . 152 parts In-Stock

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$78.734

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152

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$78.734

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Overview

Elevate your projects with the ZPSD502B1-70U from STMicroelectronics, a trusted leader in innovative technology. This versatile multi-functional peripheral offers seamless integration, ensuring high performance and reliability across applications like embedded systems, industrial automation, and consumer electronics. With its low-profile design and exceptional power efficiency, this component not only enhances your designs but also delivers lasting value, making it an essential choice for engineers seeking quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic and epoxy material ensures protection against environmental factors, enhancing the longevity of the multi-functional peripheral.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Operating safely within this voltage range helps prevent damage and ensures reliable performance in various electrical environments.

Address Bus Width: 16

A 16-bit address bus facilitates efficient data handling and supports a larger memory capacity, enhancing overall device performance.

Package Shape: SQUARE

The square package shape is ideal for space-efficient designs, allowing for a neat layout in multi-functional peripherals.

Power Supplies (V): 5

Utilizing a 5V power supply standard fits well with most consumer electronics, ensuring compatibility and ease of integration.

No. of Terminals: 80

With 80 terminals available, the device supports a wide range of connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for easy mounting in tight spaces, making it perfect for compact devices.

Minimum Supply Voltage: 4.5 V

This flexible voltage range allows for safe operation in various power environments, enhancing device reliability.

Maximum Operating Temperature: 70 °C

The ability to operate at higher temperatures ensures that the multi-functional peripheral remains reliable even in warm conditions.

Minimum Operating Temperature: 0 °C

The operational range from 0 to 70 °C indicates robustness in varying environmental conditions.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability and durability, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal positioning allows for more flexible layout options in circuit design, enhancing integration capabilities.

Maximum Seated Height: 1.6 mm

A low seated height supports multi-layer PCB designs, ideal for compact electronic systems.

RAM Words: 512

With 512 RAM words, the device supports efficient data processing, essential for high-performance applications.

Width: 14 mm

A compact width of 14 mm helps in space-efficient designs, enabling more features in smaller devices.

External Data Bus Width: 16

A 16-bit external data bus allows for high data throughput, enhancing the overall performance of the peripheral.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz ensures high-speed processing, making it suitable for time-sensitive applications.

Length: 14 mm

A small length of 14 mm maximizes space efficiency in circuit layouts, making the device ideal for compact electronics.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the peripheral is suitable for a wide range of everyday applications.

ROM Bits Size: 512 Bits

512 bits of ROM provides enough storage for essential firmware, making it versatile for various applications.

Technology: CMOS

CMOS technology allows for lower power consumption and higher efficiency, making the device suitable for battery-operated applications.

Terminal Form: GULL WING

Gull-wing terminals provide excellent mechanical strength and allow for easier soldering, enhancing reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard across many devices, ensuring compatibility and ease of integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility increases the device's versatility, making it suitable for a variety of systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact layout which is beneficial for high-density PCB designs.

Maximum Standby Current: 0.00002 Amp

Low standby current consumption enhances energy efficiency, making the device ideal for eco-friendly applications.

Maximum Access Time: 0.00000007 ns

With minimal access time, the device can achieve faster data processing speeds, crucial for performance-sensitive applications.

No. of I/O Lines: 40

40 I/O lines provide ample connectivity options for sensors, peripherals, and other devices, enhancing functionality.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD502B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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