Loading...

ZPSD502B1-70LI

STMicroelectronics

ZPSD502B1-70LI by STMicroelectronics

ZPSD502B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a max clock frequency of 36 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,667

-

-

-

-

Digiode

USA . 3,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,307

-

-

-

-

Anansix

USA . 724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

724

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,363 parts In-Stock

1+ parts

$52.729

100+ parts

-

1k+ parts

$47.456

10k+ parts

-

1,363

$52.729

-

$47.456

-

Corohmni

South Africa . 623 parts In-Stock

1+ parts

$57.628

100+ parts

-

1k+ parts

-

10k+ parts

-

623

$57.628

-

-

-

MKK Technologies

India . 936 parts In-Stock

1+ parts

$99.153

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$99.153

-

-

-

DigiPath Technology Company

USA . 936 parts In-Stock

1+ parts

$99.153

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$99.153

-

-

-

Parana Technologies

USA . 1,528 parts In-Stock

1+ parts

-

100+ parts

$63.045

1k+ parts

-

10k+ parts

-

1,528

-

$63.045

-

-

Corphita

USA . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Overview

Unlock unparalleled performance with the ZPSD502B1-70LI from STMicroelectronics, a trusted leader in innovative technology. This versatile multi-functional peripheral is crafted from high-quality ceramic and metal-sealed materials, ensuring reliability in demanding environments. Ideal for applications ranging from industrial automation to consumer electronics, it delivers superior efficiency and durability, empowering your projects with seamless integration and long-lasting power. Experience the advantage of STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed materials enhances durability, thermal stability, and protects the internal components from environmental factors, making it ideal for industrial applications.

Surface Mount: YES

Surface mount technology allows for smaller and more efficient PCB designs, which is crucial for multi-functional peripherals that often require compactness.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of devices, reducing integration issues in various electronic systems.

Address Bus Width: 16

With a 16-bit address bus width, the product can access a larger memory space, allowing for more complex processing and better performance.

Package Shape: SQUARE

A square package shape is space-efficient and easy to integrate into existing systems, making it versatile for various designs.

Power Supplies (V): 5

Operating at 5V is standard for many applications, providing convenience and compatibility with most consumer electronics.

No. of Terminals: 68

The high number of terminals enables multiple connections and integrations, facilitating complex functionalities within the peripheral.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style allows for easy handling and installation, while the window feature offers visibility for debugging and testing.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for flexible power source requirements, enhancing usability in different systems.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product reliable in challenging environments often found in industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in extreme conditions, making it suitable for outdoor and rugged applications.

Terminal Finish: TIN LEAD

Tin-lead finishes improve solderability and performance, ensuring strong connections within the circuit.

Ultraviolet Erasable: YES

Being ultraviolet erasable allows for easy reprogramming and updates, enhancing flexibility and longevity of the product.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and helps maintain compact designs, beneficial for high-density applications.

Maximum Seated Height: 4.57 mm

A low seated height is advantageous for maintaining a compact profile in various electronic assemblies.

RAM Words: 512

A RAM capacity of 512 words supports efficient data handling for multi-functional tasks, improving overall device performance.

Width: 24.105 mm

This width facilitates compact design, making it suitable for tight spaces in electronic enclosures.

External Data Bus Width: 16

A 16-bit external data bus width enhances data transfer capabilities, allowing for faster performance and communication.

Maximum Clock Frequency: 36 MHz

Operating at a maximum clock frequency of 36 MHz ensures quick response times, critical for high-performance applications.

Length: 24.105 mm

This length contributes to a compact footprint, making it easier to integrate into various multi-functional peripheral designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies robustness and reliability, essential for use in demanding environments.

ROM Bits Size: 512 Bits

A ROM size of 512 bits allows for sufficient storage of essential firmware and program instructions, vital for operation.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it suitable for energy-efficient designs.

Terminal Form: J BEND

J bend terminals provide secure mechanical connections and ease of soldering, ensuring strong circuit integration.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V aligns with standard electronic components, enhancing compatibility across devices.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility ensures this product can be integrated easily into a variety of legacy and modern systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for precision placement on PCBs, optimizing space while ensuring reliability in connections.

Maximum Standby Current: 0.00002 Amp

A very low maximum standby current significantly reduces power consumption during idle times, making it energy-efficient.

Maximum Access Time: 0.00000007 ns

Ultra-fast access times enhance performance, allowing the device to respond swiftly to commands or data requests.

No. of I/O Lines: 40

With 40 I/O lines, this product enables extensive connectivity options for various peripherals, enhancing its versatility.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD502B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20