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STPCD0166BTI3

STMicroelectronics

STPCD0166BTI3 by STMicroelectronics

STPCD0166BTI3 by STMicroelectronics is a versatile multi-functional peripheral with a 32-bit address bus and operates at a nominal voltage of 3.3 V. It supports PCI/ISA bus compatibility and functions effectively in industrial environments, with an operating temp range of -40 °C to 100°C. Its compact grid array package features 388 terminals, making it ideal for space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,316 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,316

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Digiode

USA . 1,421 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,421

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Vyrian

USA . 1,271 parts In-Stock

1+ parts

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1,271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 669 parts In-Stock

1+ parts

$32.860

100+ parts

-

1k+ parts

$29.574

10k+ parts

-

669

$32.860

-

$29.574

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$43.159

100+ parts

-

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40

$43.159

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MKK Technologies

India . 1,121 parts In-Stock

1+ parts

$61.790

100+ parts

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1,121

$61.790

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DigiPath Technology Company

USA . 1,121 parts In-Stock

1+ parts

$61.790

100+ parts

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1k+ parts

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10k+ parts

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1,121

$61.790

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Corphita

USA . 4,228 parts In-Stock

1+ parts

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4,228

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 268 parts In-Stock

1+ parts

-

100+ parts

$39.289

1k+ parts

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10k+ parts

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268

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$39.289

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Kepictronics

USA . 92 parts In-Stock

1+ parts

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92

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Overview

Elevate your designs with the STPCD0166BTI3 from STMicroelectronics, where innovation meets reliability. This versatile multi-functional peripheral stands out with exceptional quality and performance, ideal for industrial applications. With a robust temperature range and proven compatibility, it seamlessly integrates into demanding environments. Trust in STMicroelectronics’ industry expertise to enhance your projects, delivering unmatched value and performance that propels your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic and epoxy materials ensures robustness and longevity, making the product well-suited for various environments.

Surface Mount: YES

The surface mount design allows for compact assembly and efficient use of PCB space, which is ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances energy efficiency and compatibility with battery-operated devices, low-power applications.

Address Bus Width: 32

A 32-bit address bus enables extensive addressing capability, enhancing performance in data-intensive applications.

Package Shape: SQUARE

The square package shape facilitates easy integration into various layouts and configurations.

No. of Terminals: 388

A high number of terminals provides ample connection options, supporting diverse functionalities in multi-functional peripherals.

Package Style (Meter): GRID ARRAY

The grid array style allows for high-density connections, optimizing space and improving thermal management.

Minimum Supply Voltage: 3 V

The wide operating voltage range (3 V to 3.6 V) accommodates various power supply designs, enhancing versatility.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product is suitable for industrial applications where heat management is critical.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold temperatures makes this device ideal for outdoor or harsh environmental applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient layout on PCBs, facilitating better signal integrity and space utilization.

Maximum Seated Height: 2.38 mm

A low seated height ensures compatibility with compact designs and devices where space is a premium.

Width: 35 mm

The compact width makes the product suitable for various applications while enabling better thermal dissipation.

External Data Bus Width: 32

With a 32-bit data bus width, this product provides faster data transfers, improving overall system performance.

Maximum Clock Frequency: 14.318 MHz

A maximum clock frequency of 14.318 MHz supports efficient processing speeds for multi-functional applications.

Length: 35 mm

The standardized length aids in integrating with existing systems and promotes uniformity across device designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding conditions, suitable for commercial products.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operations, making this a cost-effective solution for today's electronics.

Terminal Form: BALL

Ball terminals provide enhanced mechanical stability and are easier to solder, ensuring a reliable connection in various applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V optimizes power consumption in devices, making it compatible with most modern electronic systems.

Bus Compatibility: PCI; ISA

Compatibility with both PCI and ISA buses ensures broader applicability across different platforms, enhancing integration possibilities.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for tighter spacing which is essential for high-density PCBs, accommodating modern designs.

Technical Specifications

Multi-functional Peripherals STPCD0166BTI3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 100 OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCD0166BTI3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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