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STPCC0166BTC3

STMicroelectronics

STPCC0166BTC3 by STMicroelectronics

STPCC0166BTC3 by STMicroelectronics is a 32-bit multifunctional peripheral IC with 388 terminals. It operates at a max clock frequency of 14.318 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, suitable for commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,716 parts In-Stock

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1,716

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Anansix

USA . 1,060 parts In-Stock

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1,060

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Vyrian

USA . 895 parts In-Stock

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895

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R&J Components

USA . 240 parts In-Stock

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240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,649 parts In-Stock

1+ parts

$27.978

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2,649

$27.978

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IDEA Electronic Components Group

UK . 404 parts In-Stock

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$54.124

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$48.711

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404

$54.124

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$48.711

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MKK Technologies

India . 1,024 parts In-Stock

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$101.776

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1,024

$101.776

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DigiPath Technology Company

USA . 1,024 parts In-Stock

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$101.776

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1,024

$101.776

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Corphita

USA . 1,904 parts In-Stock

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Kepictronics

USA . 1,841 parts In-Stock

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1,841

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A-Z Elektronik GmbH

Germany . 1,653 parts In-Stock

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1,653

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Parana Technologies

USA . 1,477 parts In-Stock

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$64.713

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1,477

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$64.713

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 538 parts In-Stock

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538

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Overview

Unlock endless possibilities with the STPCC0166BTC3 by STMicroelectronics, a cutting-edge multi-functional peripheral designed to elevate your projects to new heights. Crafted with precision by industry leader STMicroelectronics, this versatile component is built for reliability and performance. From PCI to ISA bus compatibility, this gem boasts a wide range of applications, promising seamless integration and unparalleled functionality. Transform your creations with the STPCC0166BTC3 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to damage, making this product suitable for long-term use.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input, accommodating various power sources.

Bit Size: 32

With a 32-bit size, this product can handle large amounts of data efficiently, making it suitable for multitasking and complex operations.

Maximum Clock Frequency: 14.318 MHz

High clock frequency allows for fast data processing and communication, improving overall performance of the product.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA bus systems ensures easy integration with existing hardware setups, making this product versatile and suitable for different configurations.

Technical Specifications

Multi-functional Peripherals STPCC0166BTC3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCC0166BTC3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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