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CY8C5668AXI-LP010

Infineon Technologies

CY8C5668AXI-LP010 by Infineon Technologies

CY8C5668AXI-LP010 by Infineon: 5.5V max supply, 85°C max temp, 33MHz clock freq. Ideal for industrial applications with I2C, USB, PS/2 bus compatibility and 72 I/O lines. Compact design with low profile flatpack package shape suitable for multi-functional peripherals.

Median Price

$20.470

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 284 parts In-Stock

1+ parts

$16.600

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$16.600

-

-

-

Farnell

UK . 5 parts In-Stock

1+ parts

$20.470

100+ parts

$14.300

1k+ parts

-

10k+ parts

-

5

$20.470

$14.300

-

-

Element14

Singapore . 10 parts In-Stock

1+ parts

$22.039

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$22.039

-

-

-

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$29.000

-

-

-

Mouser Electronics

USA . 929 parts In-Stock

1+ parts

$32.930

100+ parts

$22.000

1k+ parts

$20.980

10k+ parts

-

929

$32.930

$22.000

$20.980

-

Rochester

USA . 1,312 parts In-Stock

1+ parts

-

100+ parts

$16.290

1k+ parts

$14.580

10k+ parts

$13.720

1,312

-

$16.290

$14.580

$13.720

Verical

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$20.363

1k+ parts

$18.225

10k+ parts

$17.150

720

-

$20.363

$18.225

$17.150

Future Electronics

Canada . 352 parts In-Stock

1+ parts

-

100+ parts

$15.330

1k+ parts

-

10k+ parts

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352

-

$15.330

-

-

DigiKey

USA . 304 parts In-Stock

1+ parts

-

100+ parts

$21.440

1k+ parts

-

10k+ parts

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304

-

$21.440

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$5.720

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$5.720

-

-

-

Digiode

USA . 318 parts In-Stock

1+ parts

$11.457

100+ parts

-

1k+ parts

-

10k+ parts

-

318

$11.457

-

-

-

IBS Electronics

USA . 452 parts In-Stock

1+ parts

-

100+ parts

$21.500

1k+ parts

$24.894

10k+ parts

-

452

-

$21.500

$24.894

-

TME

Poland . 450 parts In-Stock

1+ parts

-

100+ parts

$26.260

1k+ parts

-

10k+ parts

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450

-

$26.260

-

-

Vyrian

USA . 204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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204

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,199 parts In-Stock

1+ parts

$5.720

100+ parts

-

1k+ parts

-

10k+ parts

$5.606

2,199

$5.720

-

-

$5.606

Advanced Electronics

New Zealand . 48 parts In-Stock

1+ parts

$5.834

100+ parts

$5.834

1k+ parts

$5.834

10k+ parts

-

48

$5.834

$5.834

$5.834

-

Semicontronic

India . 431 parts In-Stock

1+ parts

$10.250

100+ parts

$9.994

1k+ parts

$9.942

10k+ parts

-

431

$10.250

$9.994

$9.942

-

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$10.250

100+ parts

-

1k+ parts

-

10k+ parts

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3

$10.250

-

-

-

Corphita

USA . 476 parts In-Stock

1+ parts

$10.854

100+ parts

-

1k+ parts

-

10k+ parts

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476

$10.854

-

-

-

Corohmni

South Africa . 67 parts In-Stock

1+ parts

$35.945

100+ parts

-

1k+ parts

-

10k+ parts

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67

$35.945

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-

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Aztec Data Supply Inc.

USA . 2,542 parts In-Stock

1+ parts

$40.056

100+ parts

-

1k+ parts

-

10k+ parts

-

2,542

$40.056

-

-

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Modulus Dynamics

Lithuania . 2,146 parts In-Stock

1+ parts

$46.664

100+ parts

$44.797

1k+ parts

$42.931

10k+ parts

-

2,146

$46.664

$44.797

$42.931

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A-Z Elektronik GmbH

Germany . 4,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,599

-

-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,500

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 4,182 parts In-Stock

1+ parts

-

100+ parts

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4,182

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-

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Argo Parts USA

USA . 1,157 parts In-Stock

1+ parts

-

100+ parts

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1,157

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-

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Glotronic Ltd.

UK . 576 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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576

-

-

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Perfect Parts

USA . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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472

-

-

-

-

Overview

Unlock endless possibilities with the CY8C5668AXI-LP010 by Infineon Technologies. Crafted with precision and quality, this multi-functional peripheral offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product boasts reliability and efficiency, providing customers with value and benefits that exceed expectations. Experience seamless integration and top-notch functionality with the CY8C5668AXI-LP010, the ultimate solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mounting allows for easy installation and reduces the overall size of the product.

Maximum Supply Voltage: 5.5 V

Can handle a high supply voltage, providing stability and reliability in various operating conditions.

No. of Terminals: 100

Having a large number of terminals allows for more connectivity options and functionality.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without overheating or performance issues.

ROM Bits Size: 2097152 Bits

Large ROM size allows for storage of a significant amount of data, improving the device's versatility.

Bus Compatibility: I2C; USB; PS/2

Support for multiple bus interfaces enables easy connectivity to different devices and systems.

Technical Specifications

Multi-functional Peripherals CY8C5668AXI-LP010 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

32768

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

CY8C5668AXI-LP010 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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