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STPCE1HEBC

STMicroelectronics

STPCE1HEBC by STMicroelectronics

STPCE1HEBC by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V and operates at up to 14.318 MHz. It features a 32-bit address bus and supports PCI/ISA bus compatibility. Ideal for compact applications, it comes in a square grid array package with 388 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 629 parts In-Stock

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629

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Anansix

USA . 420 parts In-Stock

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420

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Digiode

USA . 406 parts In-Stock

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406

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$29.216

100+ parts

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$26.294

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2,130

$29.216

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$26.294

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MKK Technologies

India . 2,326 parts In-Stock

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$54.938

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2,326

$54.938

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DigiPath Technology Company

USA . 2,326 parts In-Stock

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$54.938

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2,326

$54.938

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Corohmni

South Africa . 99 parts In-Stock

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$71.752

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99

$71.752

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A-Z Elektronik GmbH

Germany . 6,309 parts In-Stock

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6,309

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Corphita

USA . 2,319 parts In-Stock

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2,319

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Parana Technologies

USA . 956 parts In-Stock

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$34.932

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956

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$34.932

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Perfect Parts

USA . 656 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 293 parts In-Stock

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293

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Overview

Unlock the potential of your designs with the STPCE1HEBC from STMicroelectronics, a leader in innovative multi-functional peripherals. This versatile component combines high performance and reliability, making it ideal for applications ranging from consumer electronics to industrial automation. With its compact form factor and energy-efficient technology, the STPCE1HEBC ensures seamless integration and superior functionality—empowering you to create cutting-edge solutions that stand out in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and reliability, making this multi-functional peripheral suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic systems, saving space and improving performance.

Maximum Supply Voltage: 2.7 V

With a maximum voltage of 2.7 V, this product is energy-efficient and can operate in low-voltage environments, reducing power consumption.

Address Bus Width: 32

A 32-bit address bus width enables the product to handle more data at once, improving processing efficiency for multi-functional tasks.

Package Shape: SQUARE

The square package shape contributes to better thermal and electrical performance while allowing for efficient use of PCB space.

No. of Terminals: 388

A high number of terminals enhances connectivity options, allowing for integration with a wide range of devices and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style supports efficient heat dissipation and improved signal integrity, ideal for high-performance applications.

Minimum Supply Voltage: 2.45 V

Operating at a minimum voltage of 2.45 V allows for flexibility in power supply options, making it suitable for diverse environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the surface mounting process, leading to easier assembly and lower manufacturing costs.

Maximum Seated Height: 2.38 mm

The low seated height allows for a compact design, making it ideal for applications where space is at a premium.

Width: 35 mm

A width of 35 mm strikes a balance between size and functionality, facilitating integration into various devices.

Boundary Scan: YES

Boundary scan capability enhances debugging and testing, leading to reduced development time and improved reliability.

External Data Bus Width: 32

The 32-bit external data bus width allows for high data throughput, critical for multi-functional operation in complex systems.

Maximum Clock Frequency: 14.318 MHz

A maximum clock frequency of 14.318 MHz ensures fast data processing, contributing to overall system responsiveness.

Length: 35 mm

The compact length of 35 mm enables versatile application across various devices without compromising performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product both efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for effective soldering processes and enhances the integrity of electrical connections.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V indicates compatibility with a wide range of low-power systems, promoting sustainability.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA buses allows for seamless integration into existing systems, ensuring versatile application.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for high density in component placement, maximizing PCB real estate usage.

No. of I/O Lines: 16

Having 16 I/O lines provides flexibility in connecting multiple devices, enhancing the multi-functionality of the peripheral.

Technical Specifications

Multi-functional Peripherals STPCE1HEBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 115 C OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of I/O Lines:

16

No. of Terminals:

388

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCE1HEBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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