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STPCC5HEBI

STMicroelectronics

STPCC5HEBI by STMicroelectronics

STPCC5HEBI by STMicroelectronics is a multifunctional peripheral IC designed for industrial applications. It operates at a nominal voltage of 2.5 V, supports a 32-bit address bus, and features a max clock frequency of 14.318 MHz. Its robust design ensures reliable performance in temperatures ranging from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,085 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,085

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-

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Vyrian

USA . 2,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,763

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Anansix

USA . 2,384 parts In-Stock

1+ parts

-

100+ parts

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2,384

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$20.523

100+ parts

$18.676

1k+ parts

$16.829

10k+ parts

-

5,000

$20.523

$18.676

$16.829

-

IDEA Electronic Components Group

UK . 410 parts In-Stock

1+ parts

$36.609

100+ parts

-

1k+ parts

$32.948

10k+ parts

-

410

$36.609

-

$32.948

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Corohmni

South Africa . 11 parts In-Stock

1+ parts

$63.288

100+ parts

-

1k+ parts

-

10k+ parts

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11

$63.288

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-

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MKK Technologies

India . 942 parts In-Stock

1+ parts

$68.840

100+ parts

-

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10k+ parts

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942

$68.840

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DigiPath Technology Company

USA . 942 parts In-Stock

1+ parts

$68.840

100+ parts

-

1k+ parts

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10k+ parts

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942

$68.840

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Corphita

USA . 3,302 parts In-Stock

1+ parts

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3,302

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Parana Technologies

USA . 1,925 parts In-Stock

1+ parts

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100+ parts

$43.771

1k+ parts

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10k+ parts

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1,925

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$43.771

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Overview

Elevate your designs with the STPCC5HEBI from STMicroelectronics—a cutting-edge multi-functional peripheral that blends reliability and performance. Designed for diverse applications, this versatile component thrives in industrial environments, delivering exceptional power management and seamless connectivity. With STMicroelectronics' renowned quality assurance, you gain peace of mind and long-lasting value, empowering your projects to achieve new heights of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures the product's longevity and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into various electronic systems.

Maximum Supply Voltage: 2.7 V

Maintaining a low maximum supply voltage contributes to energy efficiency and compatibility with low-power applications.

Address Bus Width: 32

A 32-bit address bus width improves data handling capabilities and increases system performance.

Package Shape: SQUARE

The square package shape offers a balanced footprint, allowing for easy layout and design in circuit boards.

Power Supplies (V): 3.3

Compatibility with a 3.3 V power supply makes it suitable for modern digital circuits.

No. of Terminals: 388

A high number of terminals provides extensive connectivity options, enhancing the device's versatility.

Package Style (Meter): GRID ARRAY

The grid array style enables improved thermal performance and electrical efficiency.

Minimum Supply Voltage: 2.45 V

The lower supply voltage lowers power consumption, making it an economical choice for battery-operated devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to perform in harsh conditions, suitable for industrial applications.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and improves long-term reliability of connections.

Terminal Position: BOTTOM

Bottom-terminated terminals facilitate compact designs and efficient use of space on circuit boards.

Maximum Seated Height: 2.38 mm

A low seated height aids in reducing the overall height of the assembly, ideal for space-constrained applications.

Width: 35 mm

This width provides a balanced size for integration into small form factor devices.

Boundary Scan: YES

Boundary scan support is a valuable feature for debugging and testing, ensuring high reliability.

External Data Bus Width: 32

A 32-bit external data bus width supports high-speed data transfer, enhancing overall system performance.

Maximum Clock Frequency: 14.318 MHz

The high clock frequency ensures fast processing, suitable for real-time applications.

Length: 35 mm

The length matches the width for a uniform square footprint, optimizing layout space on PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees suitable performance in a wide range of operating environments.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

A multifunction peripheral type allows for versatility, combining multiple functions into a single device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, essential for efficient circuit operation.

Terminal Form: BALL

Ball terminals provide excellent mechanical stability and reliability in electronic assemblies.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage aligns with modern digital devices, ensuring compatibility and efficiency.

Bus Compatibility: PCI; ISA

Supports multiple bus compatibility, increasing adaptability to different hardware systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for higher pin density, optimizing the design for more features in a smaller space.

Technical Specifications

Multi-functional Peripherals STPCC5HEBI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Multifunction Peripherals

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCC5HEBI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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