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STPCC4EEBC

STMicroelectronics

STPCC4EEBC by STMicroelectronics

STPCC4EEBC by STMicroelectronics is a multi-functional peripheral with 32-bit address and external data bus width. It operates at 2.45-2.7V, supports PCI and ISA bus compatibility, and has a max clock frequency of 14.318MHz. Ideal for applications requiring high-speed data processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,536

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-

-

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Anansix

USA . 2,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,406

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Vyrian

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,622 parts In-Stock

1+ parts

$41.052

100+ parts

-

1k+ parts

$36.947

10k+ parts

-

1,622

$41.052

-

$36.947

-

Corohmni

South Africa . 4 parts In-Stock

1+ parts

$41.089

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$41.089

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-

-

MKK Technologies

India . 1,361 parts In-Stock

1+ parts

$77.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$77.196

-

-

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DigiPath Technology Company

USA . 1,361 parts In-Stock

1+ parts

$77.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$77.196

-

-

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Corphita

USA . 4,340 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,340

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-

-

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Kepictronics

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,380

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-

-

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Parana Technologies

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$49.084

1k+ parts

-

10k+ parts

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880

-

$49.084

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Overview

Unlock the power of innovation with the STPCC4EEBC by STMicroelectronics, a cutting-edge Multi-functional Peripheral that sets new standards in quality and performance. Manufactured by industry leader STMicroelectronics, this versatile device is designed to exceed expectations in a variety of applications. With a focus on value and benefits for customers, the STPCC4EEBC offers unparalleled advantages that will take your projects to the next level. Experience the difference today and elevate your creations with the STPCC4EEBC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the product lightweight and durable, perfect for portable multi-functional peripherals.

Maximum Supply Voltage: 2.7 V

Higher supply voltage allows for efficient performance and power management in the device.

Address Bus Width: 32

A wider address bus allows for faster data transfer and processing, enhancing the overall performance of the multi-functional peripheral.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can withstand long hours of continuous use without overheating.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the multi-functional peripheral energy-efficient and efficient.

Technical Specifications

Multi-functional Peripherals STPCC4EEBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCC4EEBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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