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MCIMX6QP5EVT2AA

NXP Semiconductors

MCIMX6QP5EVT2AA by NXP Semiconductors

Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

Median Price

$106.340

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 2,863 parts In-Stock

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DigiKey

USA . 88 parts In-Stock

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Verical

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Vyrian

USA . 3,945 parts In-Stock

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Flip Electronics

USA . 4,582 parts In-Stock

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Anansix

USA . 2,008 parts In-Stock

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Digiode

USA . 1,209 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

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$20.000

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Corohmni

South Africa . 276 parts In-Stock

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$34.558

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Microchip USA

USA . 2,703 parts In-Stock

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UNI Independent Distributors

Spain . 4,996 parts In-Stock

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Argo Parts USA

USA . 4,366 parts In-Stock

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Continental Prestige Electronics

USA . 4,063 parts In-Stock

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Corphita

USA . 2,620 parts In-Stock

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Netroflash

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Technical Specifications

Multi-functional Peripherals MCIMX6QP5EVT2AA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MCIMX6QP5EVT2AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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