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PSD503B1-70JI

STMicroelectronics

PSD503B1-70JI by STMicroelectronics

PSD503B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its compact chip carrier design ensures efficient surface mounting for diverse electronic projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,144 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,144

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-

-

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Vyrian

USA . 1,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,896

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Anansix

USA . 431 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,179 parts In-Stock

1+ parts

$66.095

100+ parts

-

1k+ parts

-

10k+ parts

-

3,179

$66.095

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IDEA Electronic Components Group

UK . 2,164 parts In-Stock

1+ parts

$71.199

100+ parts

-

1k+ parts

$64.079

10k+ parts

-

2,164

$71.199

-

$64.079

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MKK Technologies

India . 510 parts In-Stock

1+ parts

$133.885

100+ parts

-

1k+ parts

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10k+ parts

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510

$133.885

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DigiPath Technology Company

USA . 510 parts In-Stock

1+ parts

$133.885

100+ parts

-

1k+ parts

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10k+ parts

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510

$133.885

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-

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Corphita

USA . 4,196 parts In-Stock

1+ parts

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4,196

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Parana Technologies

USA . 474 parts In-Stock

1+ parts

-

100+ parts

$85.129

1k+ parts

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10k+ parts

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474

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$85.129

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Overview

Unlock unparalleled performance with the PSD503B1-70JI from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile multi-functional peripheral that excels in diverse applications, from industrial automation to consumer electronics. Enjoy the benefits of robust reliability, low power consumption, and a compact design, all while ensuring seamless integration into your projects. Elevate your designs with this cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials ensures durability and resistance to environmental factors, making the product reliable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, which can help reduce overall product size.

Maximum Supply Voltage: 5.5 V

This moderate maximum supply voltage indicates compatibility with a range of common electronic systems, enhancing application versatility.

Address Bus Width: 16

A 16-bit address bus width allows for accessing a larger memory space, beneficial for applications requiring significant data throughput.

Package Shape: SQUARE

The square package shape contributes to easier integration into various circuit layouts, optimizing the use of board real estate.

No. of Terminals: 68

With 68 terminals, the product supports multiple connections, allowing for more functionality and interfacing options in complex systems.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is ideal for high-density applications, facilitating efficient assembly and minimizing footprint on PCBs.

Minimum Supply Voltage: 4.5 V

This minimum supply voltage ensures the product can operate effectively in a variety of power settings, broadening its use in diverse applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product reliable for use in extreme conditions, beneficial for outdoor and industrial use.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and reduces the need for complex routing, simplifying PCB design.

Maximum Seated Height: 4.57 mm

A low seated height enables the design of slim and space-efficient electronic devices, essential for modern compact electronics.

RAM Words: 512

512 words of RAM provide sufficient memory for data handling, making it suitable for applications requiring moderate data processing capability.

Width: 24.1808 mm

A width of 24.1808 mm allows for a balance between size and functionality, maintaining compatibility with a range of devices.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data handling and transfer, ideal for applications demanding high data throughput.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz supports fast operation and responsiveness, making this product well-suited for performance-critical applications.

Length: 24.1808 mm

With a length of 24.1808 mm, this product remains compact while providing ample connection options, making it versatile for various designs.

Temperature Grade: INDUSTRIAL

Industrial temperature rating signifies robust performance in harsh environments, ensuring longevity and reliability in critical applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, ideal for battery-operated devices and low-power applications.

Terminal Form: J BEND

J bend terminals provide secure mounting and better electrical contact, improving product reliability in various applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with industry standards, ensuring compatibility with a wide range of electronic equipment.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows for easy integration into existing systems, facilitating upgrades and future-proofing designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables compact layout designs while maintaining ease of soldering, enhancing manufacturability.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options for interfacing with various peripherals, enhancing product flexibility.

Technical Specifications

Multi-functional Peripherals PSD503B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD503B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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