Loading...

ZPSD502B1-90LI

STMicroelectronics

ZPSD502B1-90LI by STMicroelectronics

ZPSD502B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, ideal for industrial applications requiring reliability in extreme temps (-40 °C to 85 °C). With a compact chip carrier design, it supports various bus architectures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,613

-

-

-

-

Digiode

USA . 2,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

-

-

-

-

Anansix

USA . 289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

289

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 481 parts In-Stock

1+ parts

$32.488

100+ parts

-

1k+ parts

$29.239

10k+ parts

-

481

$32.488

-

$29.239

-

MKK Technologies

India . 61 parts In-Stock

1+ parts

$61.091

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$61.091

-

-

-

DigiPath Technology Company

USA . 61 parts In-Stock

1+ parts

$61.091

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$61.091

-

-

-

Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

$38.844

1k+ parts

-

10k+ parts

-

1,663

-

$38.844

-

-

Corphita

USA . 1,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,563

-

-

-

-

Overview

Unlock unparalleled performance with the ZPSD502B1-90LI by STMicroelectronics! Renowned for its commitment to quality and innovation, STMicroelectronics delivers a multi-functional peripheral that excels in versatility and reliability. Ideal for industrial applications, this chip ensures robust operation under extreme temperatures while providing efficient data handling. Elevate your projects with superior technology that translates into exceptional value and unmatched dependability!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed co-fired package ensures durability and reliability, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability offers improved performance due to reduced parasitic inductance and allows for more compact designs.

Maximum Supply Voltage: 5.5 V

The higher supply voltage threshold provides flexibility for interfacing with a variety of power systems.

Address Bus Width: 16

A wider address bus allows for greater memory addressing capabilities, thus enhancing overall system performance.

Package Shape: SQUARE

The square package shape is suitable for efficient space utilization on printed circuit boards.

Power Supplies (V): 5

Standard 5V power supply makes integration easier with common electronic systems.

No. of Terminals: 68

A high number of terminals allows for more I/O connections, increasing versatility and functionality.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with window facilitates easy access to optical components if required.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement ensures reliable operation within a broad range of environments.

Maximum Operating Temperature: 85 °C

High temperature tolerance allows the device to function in demanding industrial conditions.

Minimum Operating Temperature: -40 °C

Operational capability at -40 °C ensures reliable performance in extremely cold environments.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and contributes to reliable electrical connections.

Ultraviolet Erasable: Y

UV erasable features enable easy reprogramming, making the device adaptable for various applications.

Terminal Position: QUAD

Quad terminal position optimizes layout and space on circuit boards, facilitating easier component placement.

Maximum Seated Height: 4.57 mm

Compact seated height allows for slimmer designs in multi-functional peripherals, saving space.

RAM Words: 512

512 RAM words provide significant data storage capacity for complex processing tasks.

Width: 24.105 mm

Standard width of 24.105 mm is suitable for various applications and easily integrates into existing designs.

External Data Bus Width: 16

16-bit external data bus improves data transfer rates, contributing to better performance.

Maximum Clock Frequency: 30 MHz

A clock speed of 30 MHz supports high-speed processing, ideal for demanding applications.

Length: 24.105 mm

Consistent length aids in standardization, making it easier to design compatible systems.

Temperature Grade: INDUSTRIAL

Rated for industrial use, ensuring reliability and performance in harsh conditions.

ROM Bits Size: 512 Bits

512 bits of embedded ROM provides essential program storage, enabling efficient operations.

Technology: CMOS

CMOS technology results in lower power consumption and better performance, making it an energy-efficient choice.

Terminal Form: J BEND

J bend terminals enable secure mounting and connection reliability in electronic assemblies.

Nominal Supply Voltage: 5 V

The nominal voltage specification at 5V is standard, facilitating widespread adoption in various applications.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility allows for easy integration into diverse systems, enhancing utility and versatility.

Terminal Pitch: 1.27 mm

A pitch of 1.27 mm aids in compact layouts, allowing more intensive circuit designs.

Maximum Standby Current: 0.00002 Amp

Industry-leading low standby current minimizes power wastage during idle periods.

Maximum Access Time: 0.00000009 ns

Very low access time enables rapid data retrieval, optimizing performance in high-speed applications.

No. of I/O Lines: 40

40 input/output lines provide extensive interfacing options for a variety of sensors and devices.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD502B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20