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TFB2002BPPM

Texas Instruments

TFB2002BPPM by Texas Instruments

TFB2002BPPM by Texas Instruments is a multi-functional peripheral with 208 terminals in a square package. It operates b/w -20 to 85 °C, supporting an address bus width of 36 and external data bus width of 64. Ideal for systems requiring compatibility with various buses like 680X0, SPARC, and AXP at a clock frequency of up to 25 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,211 parts In-Stock

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Digiode

USA . 3,589 parts In-Stock

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3,589

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Distributors (Availability)

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$5.221

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292

$5.221

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One Stop Electronics

USA . 613 parts In-Stock

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$34.000

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613

$34.000

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Parana Technologies

USA . 874 parts In-Stock

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$43.618

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874

$43.618

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DigiPath Technology Company

USA . 1,425 parts In-Stock

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$48.029

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1,425

$48.029

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ChromeModa Solutions

Germany . 1,402 parts In-Stock

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$49.009

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$40.187

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1,402

$49.009

$40.187

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IDEA Electronic Components Group

UK . 978 parts In-Stock

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$49.009

100+ parts

$46.559

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$44.108

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978

$49.009

$46.559

$44.108

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Corohmni

South Africa . 5,064 parts In-Stock

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$55.982

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$55.982

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Corphita

USA . 2,787 parts In-Stock

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2,787

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Overview

Enhance your electronics projects with the TFB2002BPPM by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a versatile Multi-functional Peripheral, this product offers endless possibilities for integration in various applications. With a durable plastic/epoxy body, surface mount capability, and compatibility with multiple bus architectures, this device provides unparalleled value and performance. Elevate your designs with the TFB2002BPPM and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and strength, ensuring the product can withstand daily use.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for more reliable performance and better power management.

Address Bus Width: 36

A wider address bus allows for faster data transfer and processing, enhancing the overall efficiency of the product.

Package Shape: SQUARE

The square package shape allows for efficient use of space, making the product compact and easy to integrate into different setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function effectively in various environments without risk of overheating.

External Data Bus Width: 64

Having a wider external data bus width enables faster communication between components, leading to improved performance and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in different operating conditions.

Technical Specifications

Multi-functional Peripherals TFB2002BPPM attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

36

Boundary Scan:

YES

Bus Compatibility:

680X0; 88XXX; 80X86; SPARC; R4000; AXP

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of I/O Lines:

0

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

TFB2002BPPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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