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CY8C3866LTI-068T

Infineon Technologies

CY8C3866LTI-068T by Infineon Technologies

CY8C3866LTI-068T by Infineon Technologies is a multi-functional peripheral with 48 terminals, operating at temperatures from -40 to 85°C. It features a max clock frequency of 67 MHz and supports I2C, USB, PS/2, and 8051 bus compatibility. This chip carrier has a square package shape with dimensions of 7mm x 7mm and requires a supply voltage b/w 1.71V to 5.5V for various industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,239 parts In-Stock

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1,239

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Digiode

USA . 62 parts In-Stock

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62

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,914 parts In-Stock

1+ parts

$17.966

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2,914

$17.966

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AZTECH Wire

Italy . 378 parts In-Stock

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$19.410

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378

$19.410

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Semicontronic

India . 1,324 parts In-Stock

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$25.000

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$24.375

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$24.250

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1,324

$25.000

$24.375

$24.250

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Ampacity Inc.

Singapore . 1,110 parts In-Stock

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$30.000

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$30.000

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Corohmni

South Africa . 90 parts In-Stock

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$34.446

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90

$34.446

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Microchip USA

USA . 2,757 parts In-Stock

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$39.592

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2,757

$39.592

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Modulus Dynamics

Lithuania . 805 parts In-Stock

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$57.922

100+ parts

$55.605

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$53.288

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805

$57.922

$55.605

$53.288

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Component Stockers USA

USA . 704 parts In-Stock

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$183.570

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704

$183.570

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QUARKTWIN TECHNOLOGY LTD

USA . 14,697 parts In-Stock

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14,697

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Continental Prestige Electronics

USA . 3,845 parts In-Stock

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Argo Parts USA

USA . 3,580 parts In-Stock

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Corphita

USA . 659 parts In-Stock

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659

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Discover the powerful capabilities of the CY8C3866LTI-068T by Infineon Technologies, a leading manufacturer in the electronics industry. This multi-functional peripheral offers unmatched versatility and efficiency for a wide range of applications. From its reliable surface mount design to its impressive operating temperature range, this product exceeds expectations in performance and durability. With Infineon's commitment to quality and innovation, customers can trust in the value and benefits that this advanced technology brings to their projects. Experience seamless integration and enhanced functionality with the CY8C3866LTI-068T - the perfect solution for your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient integration into electronic devices, saving space and reducing overall product footprint.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this multi-functional peripheral can operate reliably under various power supply conditions.

Package Shape: SQUARE

The square package shape offers ease of handling and efficient placement within the device, optimizing space utilization.

Power Supplies (V): 2/5

Support for multiple power supplies (2V and 5V) provides flexibility in powering the device, accommodating different voltage requirements.

No. of Terminals: 48

The large number of terminals allows for connectivity to multiple external components, expanding the functionality of the peripheral.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer thermal efficiency and compact design, enhancing performance and form factor.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and compatibility with lower power supply sources, saving energy and reducing operating costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this peripheral can withstand elevated temperatures, ensuring reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for operation in extreme cold environments, making it suitable for a variety of applications.

Terminal Finish: PURE TIN

Pure tin terminal finish provides excellent conductivity and durability, ensuring reliable connections for long-term performance.

Ultraviolet Erasable: N

Non-Ultraviolet erasable technology means that data stored in the peripheral is secure and protected from accidental erasure.

Terminal Position: QUAD

Quad terminal position offers ease of installation and connection, simplifying the integration process of the peripheral into the device.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim design and low profile installation, making it suitable for space-constrained applications.

RAM Words: 4096

Ample RAM capacity of 4096 words enables efficient data processing and storage, enhancing the overall performance of the multi-functional peripheral.

Width: 7 mm

The compact width of 7mm contributes to the overall small form factor of the peripheral, making it suitable for compact electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the peripheral during manufacturing and maintenance, enhancing product reliability.

Maximum Clock Frequency: 67 MHz

With a high maximum clock frequency of 67 MHz, this peripheral can handle high-speed data processing and communication tasks effectively.

Length: 7 mm

The short length of 7mm contributes to the compact design of the peripheral, enabling it to fit into space-constrained devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh industrial environments, making this peripheral suitable for industrial applications.

ROM Bits Size: 65536 Bits

Large ROM capacity of 65536 bits allows for storing a significant amount of data, enabling versatile functionality and customization options for the peripheral.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall efficiency and performance of the peripheral.

Terminal Form: NO LEAD

Non-lead terminal form complies with environmental regulations and standards, making this peripheral eco-friendly and safe for use.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable power input for optimal performance and compatibility with standard voltage levels.

Bus Compatibility: I2C; USB; PS/2; 8051

Wide bus compatibility with I2C, USB, PS/2, and 8051 interfaces allows for seamless integration with various systems, expanding versatility and application possibilities.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and precise connections, contributing to the compact design and efficient layout of the peripheral.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to protect the peripheral during assembly and operation.

No. of I/O Lines: 31

The ample number of I/O lines allows for versatile input and output functions, enabling the peripheral to interface with multiple external devices and systems effectively.

Technical Specifications

Multi-functional Peripherals CY8C3866LTI-068T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2; 8051

Maximum Clock Frequency:

67 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.3SQ,40

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

4096

ROM Bits Size:

65536 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

7 mm

Trade Compliance

CY8C3866LTI-068T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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