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PSD503B1-70UI

STMicroelectronics

PSD503B1-70UI by STMicroelectronics

PSD503B1-70UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its low-profile flatpack design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,378

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-

-

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Vyrian

USA . 1,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,685

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-

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Anansix

USA . 1,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,666

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,221 parts In-Stock

1+ parts

$24.719

100+ parts

-

1k+ parts

$22.248

10k+ parts

-

2,221

$24.719

-

$22.248

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MKK Technologies

India . 1,486 parts In-Stock

1+ parts

$46.483

100+ parts

-

1k+ parts

-

10k+ parts

-

1,486

$46.483

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DigiPath Technology Company

USA . 1,486 parts In-Stock

1+ parts

$46.483

100+ parts

-

1k+ parts

-

10k+ parts

-

1,486

$46.483

-

-

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Corohmni

South Africa . 4,929 parts In-Stock

1+ parts

$78.766

100+ parts

-

1k+ parts

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10k+ parts

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4,929

$78.766

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Corphita

USA . 653 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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653

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Parana Technologies

USA . 529 parts In-Stock

1+ parts

-

100+ parts

$29.556

1k+ parts

-

10k+ parts

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529

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$29.556

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Overview

Elevate your designs with the PSD503B1-70UI from STMicroelectronics, a trusted leader in high-quality multi-functional peripherals. This compact powerhouse ensures reliable performance across various applications, from industrial automation to consumer electronics. With its robust temperature range and efficient power management, it delivers exceptional value, allowing you to innovate confidently while enjoying enhanced durability and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable in various industrial conditions.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier integration into automated assembly processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in application while ensuring safe operating conditions.

Address Bus Width: 16

With a 16-bit address bus, this product can handle a larger memory space, making it suitable for complex applications.

Package Shape: SQUARE

The square package shape optimizes space on the printed circuit board, facilitating more compact designs.

No. of Terminals: 80

Having 80 terminals allows for numerous functionalities and connections, making it versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is beneficial in applications where height restrictions are critical.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a range of power sources, enhancing usability.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this product suitable for harsh industrial environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extremely cold conditions.

Terminal Position: QUAD

Quad terminal positioning provides better layout options on PCBs, improving design flexibility.

Maximum Seated Height: 1.6 mm

A low seated height helps in minimizing the overall profile of the device, suitable for compact applications.

RAM Words: 512

With 512 RAM words, this product has sufficient memory for processing tasks, enhancing performance.

Width: 14 mm

A width of 14 mm makes it compact, allowing for efficient use of space in designs.

External Data Bus Width: 16

The 16-bit external data bus width permits faster data processing and communication with other devices.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz allows for quick data processing, benefiting high-speed applications.

Length: 14 mm

A length of 14 mm contributes to the compact nature of the device, enabling integration into smaller footprints.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed to withstand challenging conditions, ensuring reliability and longevity.

Technology: CMOS

CMOS technology is energy-efficient, leading to lower power consumption and heat generation, ideal for long-term applications.

Terminal Form: GULL WING

Gull wing terminals facilitate automatic soldering processes, improving production efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with standard power supplies in most electronic systems.

Bus Compatibility: 8031, 80196, 80196SP, 80186, 68HC11, 68HC16, 68330, 68331, 68340, 68302, 16000, Z80, Z8

Wide bus compatibility makes this product versatile and easy to integrate into various systems and applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a high density of connections on boards, optimizing space and functionality.

No. of I/O Lines: 40

With 40 I/O lines, this product can support multiple devices and functionalities, making it highly adaptable.

Technical Specifications

Multi-functional Peripherals PSD503B1-70UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PSD503B1-70UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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