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CY8C6347FMI-BLD53T

Infineon Technologies

CY8C6347FMI-BLD53T by Infineon Technologies

Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e1;

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 14 parts In-Stock

1+ parts

$3.160

100+ parts

$3.160

1k+ parts

$3.160

10k+ parts

-

14

$3.160

$3.160

$3.160

-

Arrow

USA . 759 parts In-Stock

1+ parts

$3.384

100+ parts

-

1k+ parts

-

10k+ parts

-

759

$3.384

-

-

-

Verical

USA . 690 parts In-Stock

1+ parts

$3.857

100+ parts

$3.676

1k+ parts

$3.555

10k+ parts

-

690

$3.857

$3.676

$3.555

-

Chip1Stop

Japan . 700 parts In-Stock

1+ parts

$11.143

100+ parts

$9.238

1k+ parts

$8.990

10k+ parts

-

700

$11.143

$9.238

$8.990

-

RS (Exports)

UK . 100 parts In-Stock

1+ parts

$14.706

100+ parts

$11.312

1k+ parts

$10.297

10k+ parts

-

100

$14.706

$11.312

$10.297

-

Element14

Singapore . 1,619 parts In-Stock

1+ parts

-

100+ parts

$11.124

1k+ parts

-

10k+ parts

-

1,619

-

$11.124

-

-

Farnell

UK . 1,108 parts In-Stock

1+ parts

-

100+ parts

$6.060

1k+ parts

-

10k+ parts

-

1,108

-

$6.060

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 28 parts In-Stock

1+ parts

$6.660

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$6.660

-

-

-

Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$9.872

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$9.872

-

-

-

IBS Electronics

USA . 44,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$10.108

44,200

-

-

-

$10.108

Vyrian

USA . 3,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,740

-

-

-

-

Chip Stock

USA . 634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

634

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,931 parts In-Stock

1+ parts

$2.690

100+ parts

$2.623

1k+ parts

$2.609

10k+ parts

-

3,931

$2.690

$2.623

$2.609

-

Ampacity Inc.

Singapore . 3,643 parts In-Stock

1+ parts

$2.690

100+ parts

-

1k+ parts

-

10k+ parts

-

3,643

$2.690

-

-

-

Corphita

USA . 863 parts In-Stock

1+ parts

$6.309

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$6.309

-

-

-

Continental Prestige Electronics

USA . 436 parts In-Stock

1+ parts

$10.560

100+ parts

$8.200

1k+ parts

-

10k+ parts

-

436

$10.560

$8.200

-

-

Aztec Data Supply Inc.

USA . 3,755 parts In-Stock

1+ parts

$14.839

100+ parts

-

1k+ parts

-

10k+ parts

-

3,755

$14.839

-

-

-

Modulus Dynamics

Lithuania . 107 parts In-Stock

1+ parts

$24.220

100+ parts

$23.251

1k+ parts

$22.282

10k+ parts

-

107

$24.220

$23.251

$22.282

-

Microchip USA

USA . 2,856 parts In-Stock

1+ parts

$25.911

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

$25.911

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$59.932

100+ parts

$56.935

1k+ parts

$56.935

10k+ parts

-

1,000

$59.932

$56.935

$56.935

-

Corohmni

South Africa . 2,628 parts In-Stock

1+ parts

$68.190

100+ parts

-

1k+ parts

-

10k+ parts

-

2,628

$68.190

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Argo Parts USA

USA . 2,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,762

-

-

-

-

Technical Specifications

Multi-functional Peripherals CY8C6347FMI-BLD53T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

Terminal Finish:

TIN SILVER COPPER

Trade Compliance

CY8C6347FMI-BLD53T Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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