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PSD502B1-15LI

STMicroelectronics

PSD502B1-15LI by STMicroelectronics

PSD502B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, ideal for industrial applications requiring reliability in extreme temperatures (-40 °C to 85°C). With a max clock frequency of 34.48 MHz, it supports various bus architectures, enhancing compatibility across systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,863 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,863

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Digiode

USA . 829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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829

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Anansix

USA . 415 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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415

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,055 parts In-Stock

1+ parts

$46.461

100+ parts

-

1k+ parts

$41.815

10k+ parts

-

1,055

$46.461

-

$41.815

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MKK Technologies

India . 1,392 parts In-Stock

1+ parts

$87.367

100+ parts

-

1k+ parts

-

10k+ parts

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1,392

$87.367

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DigiPath Technology Company

USA . 1,392 parts In-Stock

1+ parts

$87.367

100+ parts

-

1k+ parts

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10k+ parts

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1,392

$87.367

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Corphita

USA . 4,516 parts In-Stock

1+ parts

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4,516

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Parana Technologies

USA . 2,069 parts In-Stock

1+ parts

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100+ parts

$55.551

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10k+ parts

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2,069

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$55.551

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Overview

Unlock the power of innovation with the PSD502B1-15LI from STMicroelectronics! Renowned for their commitment to quality, STMicroelectronics delivers a versatile multi-functional peripheral that enhances your projects with reliability and precision. Whether you're designing industrial automation systems or advanced consumer electronics, this robust chip ensures optimal performance in demanding environments, offering unparalleled value and efficiency for your applications. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material ensures high reliability and performance in demanding industrial environments.

Surface Mount: YES

The surface mount feature allows for easier installation and smaller PCB space consumption.

Maximum Supply Voltage: 5.5 V

This higher limit offers flexibility in design and is compatible with various power supply systems.

Address Bus Width: 16

A 16-bit address bus allows for addressing larger memory, enhancing performance for intricate applications.

Package Shape: SQUARE

The square shape contributes to efficient heat dissipation and supports space-efficient layouts.

Power Supplies (V): 5

Operating at a standard 5V will ease integration with existing systems, making it a versatile choice.

No. of Terminals: 68

A higher number of terminals allows for more connectivity options, suitable for complex applications.

Package Style (Meter): CHIP CARRIER, WINDOW

This style allows for easy inspection and enhances manufacturing efficiency with its design.

Minimum Supply Voltage: 4.5 V

Lower voltage requirements make it energy-efficient, ideal for battery-powered and low-energy applications.

Maximum Operating Temperature: 85 °C

This high-temperature tolerance ensures reliable operation in a variety of challenging environments.

Minimum Operating Temperature: -40 °C

Withstanding low temperatures makes it suitable for outdoor and extreme condition applications.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability and long-term reliability.

Ultraviolet Erasable: Y

The ultraviolet erasable feature allows for easy reprogramming, increasing versatility in various applications.

Terminal Position: QUAD

This position enhances the layout flexibility on the PCB for better space management.

Maximum Seated Height: 4.57 mm

The compact height is beneficial for fitting into tighter spaces within multi-functional systems.

RAM Words: 512

Having adequate RAM improves the performance for data handling in complex multi-functional peripherals.

Width: 24.105 mm

This specific width contributes to standardization and ease of integration into existing systems.

External Data Bus Width: 16

The 16-bit data bus enables faster data transfer rates, improving overall system efficiency.

Maximum Clock Frequency: 34.48 MHz

A high clock frequency ensures quick processing capabilities, making it efficient for multi-task operations.

Length: 24.105 mm

Maintaining a consistent length aids in aligning with design standards for ease of installation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability for use in industrial-grade applications or tough environments.

ROM Bits Size: 512 Bits

Adequate ROM size supports essential firmware storage for a variety of functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, beneficial for efficient performance.

Terminal Form: J BEND

This terminal form aids in secure mounting and facilitates efficient soldering during assembly.

Nominal Supply Voltage: 5 V

Standard nominal voltage increases compatibility with common power sources and simplifies design.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility ensures versatility and ease of integration with various existing systems.

Terminal Pitch: 1.27 mm

The standard terminal pitch supports ease of manufacturing and reliable automated assembly processes.

Maximum Standby Current: 0.00002 Amp

Low standby current enhances energy efficiency, making it ideal for low power and battery-operated applications.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time improves the overall responsiveness of systems using this component.

No. of I/O Lines: 40

Having 40 I/O lines allows for extensive peripheral connections, making it suitable for complex multi-functional peripherals.

Technical Specifications

Multi-functional Peripherals PSD502B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

PSD502B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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