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TS68HC901CFN8

STMicroelectronics

TS68HC901CFN8 by STMicroelectronics

TS68HC901CFN8 by STMicroelectronics is a versatile multi-functional peripheral with a 5V nominal supply and operates at up to 8 MHz. It features an address bus width of 5 and supports 8 I/O lines, making it ideal for embedded systems. Its compact chip carrier design ensures efficient integration in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,928 parts In-Stock

1+ parts

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3,928

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Digiode

USA . 3,525 parts In-Stock

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3,525

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Anansix

USA . 1,603 parts In-Stock

1+ parts

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1,603

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Halfin

Belgium . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,960 parts In-Stock

1+ parts

$41.254

100+ parts

-

1k+ parts

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10k+ parts

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1,960

$41.254

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IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$48.523

100+ parts

-

1k+ parts

$43.670

10k+ parts

-

267

$48.523

-

$43.670

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MKK Technologies

India . 474 parts In-Stock

1+ parts

$91.244

100+ parts

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474

$91.244

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DigiPath Technology Company

USA . 474 parts In-Stock

1+ parts

$91.244

100+ parts

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474

$91.244

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Corphita

USA . 3,048 parts In-Stock

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3,048

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Parana Technologies

USA . 1,677 parts In-Stock

1+ parts

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$58.016

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1,677

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$58.016

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Overview

Unlock unparalleled performance with the TS68HC901CFN8 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral is designed to elevate your projects, ensuring reliability and efficiency across diverse applications—from consumer electronics to industrial systems. With its robust design and exceptional quality, you gain enhanced functionality while simplifying integration, empowering you to create cutting-edge products that stand out in today’s competitive market. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is lightweight and resistant to environmental factors, enhancing durability.

Surface Mount: YES

Surface mount technology facilitates easy integration into modern electronic circuits, saving space and improving performance.

Maximum Supply Voltage: 5.25 V

The maximum supply voltage allows for robust performance in various operating conditions while ensuring safe operation within limits.

Address Bus Width: 5

A 5-bit address bus width provides adequate addressable space for various applications, enhancing flexibility.

Package Shape: SQUARE

The square shape of the package promotes efficient space utilization on PCB layouts.

Power Supplies (V): 5

Designed for standard 5V power supplies, making it compatible with many existing electronic systems.

No. of Terminals: 52

With 52 terminals, the device offers extensive connectivity options, allowing for complex integration with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style supports easier handling and soldering during assembly, improving manufacturing efficiency.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage ensures reliable operation even in low-voltage conditions, providing more stability across a range of applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a variety of environments, enhancing longevity.

Minimum Operating Temperature: 0 °C

Operational range starts from 0 °C, making the device suitable for a wide range of temperature-sensitive applications.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish improves solderability and helps ensure a robust electrical connection.

Terminal Position: QUAD

The quad terminal position facilitates efficient routing on printed circuit boards, optimizing design layout.

Maximum Seated Height: 5.08 mm

With a compact seated height, this component is suitable for applications where space is at a premium.

Width: 19.1262 mm

The width allows for easy placement on most PCB layouts while maintaining compatibility with standard component footprints.

External Data Bus Width: 8

An 8-bit external data bus width supports efficient data handling and enhances overall throughput for performance applications.

Maximum Clock Frequency: 8 MHz

A maximum clock frequency of 8 MHz allows for efficient processing speeds, making it suitable for a variety of tasks.

Length: 19.1262 mm

The length complements the width for a perfectly square design, ensuring uniformity and ease of integration into PCBs.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures that the device meets standard operating conditions for typical consumer electronics.

Technology: HCMOS

HCMOS technology provides low power consumption and high-speed performance, making it ideal for modern applications.

Terminal Form: J BEND

J BEND terminal form allows for secure mounting and easy soldering, ensuring a robust connection to the PCB.

Maximum Supply Current: 6 mA

Low maximum supply current makes the device energy-efficient, contributing to overall system power savings.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5 V, making it compatible with a wide range of electronic devices.

Bus Compatibility: 68000

Compatibility with the 68000 bus allows for integration with a variety of microcontrollers and processors, enhancing versatility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compact design and ease of soldering, making it suitable for dense PCB layouts.

No. of I/O Lines: 8

Eight I/O lines provide ample connection options for a variety of peripherals, enhancing its functionality.

Technical Specifications

Multi-functional Peripherals TS68HC901CFN8 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

5

Boundary Scan:

NO

Bus Compatibility:

68000

Maximum Clock Frequency:

8 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e0

Length:

19.1262 mm

No. of I/O Lines:

8

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Trade Compliance

TS68HC901CFN8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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