Loading...

PSD511B1-90JI

STMicroelectronics

PSD511B1-90JI by STMicroelectronics

PSD511B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus types, making it ideal for industrial applications. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,920

-

-

-

-

Anansix

USA . 2,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,541

-

-

-

-

Digiode

USA . 992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

992

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,654 parts In-Stock

1+ parts

$43.245

100+ parts

-

1k+ parts

$38.920

10k+ parts

-

1,654

$43.245

-

$38.920

-

MKK Technologies

India . 1,235 parts In-Stock

1+ parts

$81.319

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$81.319

-

-

-

DigiPath Technology Company

USA . 1,235 parts In-Stock

1+ parts

$81.319

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$81.319

-

-

-

Corphita

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,450

-

-

-

-

Parana Technologies

USA . 2,366 parts In-Stock

1+ parts

-

100+ parts

$51.706

1k+ parts

-

10k+ parts

-

2,366

-

$51.706

-

-

Overview

Unlock the potential of your applications with the PSD511B1-90JI from STMicroelectronics—a trusted leader in advanced semiconductor solutions. Designed for versatility, this multi-functional peripheral enhances performance across a range of industrial environments. With robust durability and efficiency, it ensures seamless integration and operation, making it ideal for embedded systems and data processing tasks. Experience superior quality and reliability that set your projects apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures that the device is lightweight and resilient, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for smaller footprint on PCBs, enabling more compact designs in multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard logic levels and safe operation in various circuits.

Address Bus Width: 16

A 16-bit address bus allows for addressing a larger memory space, enhancing the device's capability to handle complex tasks.

Package Shape: SQUARE

The square package shape optimizes space efficiency and helps in easier placement on printed circuit boards.

No. of Terminals: 68

Having 68 terminals provides ample connectivity for I/O operations, making it versatile for numerous applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging improves thermal performance and provides robust mechanical support for the integrated circuits.

Minimum Supply Voltage: 4.5 V

The ability to operate as low as 4.5 V enables integration into low-power applications, making it energy-efficient.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C assures reliability in high-temperature environments, which is essential for industrial applications.

Minimum Operating Temperature: -40 °C

Operating effectively at -40 °C means this product is suitable for extreme conditions, making it ideal for outdoor and harsh environments.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of traces on PCBs and enhances connectivity options.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm maximizes space saving on PCBs, enabling more compact designs.

RAM Words: 1024

With 1024 words of RAM, this device can handle complex data processing tasks efficiently, enhancing its functionality.

Width: 24.1808 mm

The compact width of 24.1808 mm allows for space-optimized designs, making it easier to fit into various configurations.

External Data Bus Width: 8

An 8-bit external data bus allows for efficient data transfer and communication with various peripheral devices.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, the device is capable of performing operations at fast speeds, enhancing overall performance.

Length: 24.1808 mm

This length ensures that the device can be easily accommodated in tight spaces without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability and durability, suitable for demanding industrial applications.

Technology: CMOS

Utilizing CMOS technology leads to reduced power consumption and high efficiency, which is crucial for multi-functional peripherals.

Terminal Form: J BEND

J bend terminals provide enhanced mechanical stability and easier soldering during assembly, enhancing manufacturing reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is standard in many applications, ensuring compatibility and ease of integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility makes this product versatile and adaptable for various systems, enhancing its usability in different applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between space-saving design and ease of soldering, making assembly straightforward.

No. of I/O Lines: 40

With 40 I/O lines available, this product can support multiple peripheral devices, providing versatility for various system configurations.

Technical Specifications

Multi-functional Peripherals PSD511B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD511B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20