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PSD513B1-90UI

STMicroelectronics

PSD513B1-90UI by STMicroelectronics

PSD513B1-90UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and 40 I/O lines. It operates b/w -40 °C to 85°C, supporting a max supply voltage of 5.5V and clock frequency of 30MHz. Ideal for industrial applications, it features low-profile packaging for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,567 parts In-Stock

1+ parts

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100+ parts

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4,567

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Vyrian

USA . 2,360 parts In-Stock

1+ parts

-

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1k+ parts

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2,360

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Anansix

USA . 2,281 parts In-Stock

1+ parts

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100+ parts

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2,281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 776 parts In-Stock

1+ parts

$61.278

100+ parts

-

1k+ parts

$55.151

10k+ parts

-

776

$61.278

-

$55.151

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MKK Technologies

India . 1,016 parts In-Stock

1+ parts

$115.230

100+ parts

-

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-

10k+ parts

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1,016

$115.230

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DigiPath Technology Company

USA . 1,016 parts In-Stock

1+ parts

$115.230

100+ parts

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10k+ parts

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1,016

$115.230

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Corphita

USA . 4,285 parts In-Stock

1+ parts

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4,285

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Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

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100+ parts

$73.268

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10k+ parts

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1,569

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$73.268

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Overview

Unlock unparalleled performance with the PSD513B1-90UI from STMicroelectronics, a leader in innovative solutions. Designed for multi-functional peripherals, this compact and robust device ensures reliability across a wide temperature range, making it ideal for industrial applications. With low-profile packaging and exceptional compatibility, it seamlessly integrates into diverse systems, delivering efficiency and longevity that elevate your projects to new heights. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials increases durability and protects the internal components, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, saving space on PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies and reduces the risk of damage from overvoltage.

Address Bus Width: 16

With a 16-bit address bus width, the product can address a sizable memory range, enhancing performance for complex applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and performance.

No. of Terminals: 80

Having 80 terminals facilitates numerous connectivity options and enhances integration capabilities with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design promotes better airflow and thermal management, crucial for high-performance applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V offers flexibility in power supply design while ensuring stable operation.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for extreme conditions, expanding its application range.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and allows for efficient routing on the PCB.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm contributes to a compact design, making it ideal for space-constrained applications.

RAM Words: 1024

With 1024 RAM words, the product efficiently handles data processing tasks, improving overall performance.

Width: 14 mm

A width of 14 mm strikes a balance between compact design and sufficient terminal spacing for ease of soldering.

External Data Bus Width: 8

An 8-bit external data bus width allows for optimized data transfer rates, suitable for various applications.

Maximum Clock Frequency: 30 MHz

A clock frequency of 30 MHz offers good performance for real-time processing applications.

Length: 14 mm

At a length of 14 mm, this component is compact, making it suitable for tight spaces in modern designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability in harsh conditions, making it suitable for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption, which is critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved mechanical stability on the circuit board.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronic applications, ensuring compatibility with existing designs.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows integration with a variety of older and contemporary systems, enhancing versatility.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm ensures a compact footprint while maintaining soldering ease.

No. of I/O Lines: 40

Having 40 I/O lines provides ample connectivity options for various peripherals and components, increasing the product's utility.

Technical Specifications

Multi-functional Peripherals PSD513B1-90UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PSD513B1-90UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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