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ZPSD503B1-15LI

STMicroelectronics

ZPSD503B1-15LI by STMicroelectronics

ZPSD503B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a max clock frequency of 34.48 MHz, it ensures efficient performance in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,580 parts In-Stock

1+ parts

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3,580

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Vyrian

USA . 224 parts In-Stock

1+ parts

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100+ parts

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224

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Anansix

USA . 71 parts In-Stock

1+ parts

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100+ parts

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 116 parts In-Stock

1+ parts

$28.279

100+ parts

-

1k+ parts

$25.451

10k+ parts

-

116

$28.279

-

$25.451

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MKK Technologies

India . 1,147 parts In-Stock

1+ parts

$53.177

100+ parts

-

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10k+ parts

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1,147

$53.177

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DigiPath Technology Company

USA . 1,147 parts In-Stock

1+ parts

$53.177

100+ parts

-

1k+ parts

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10k+ parts

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1,147

$53.177

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-

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Corohmni

South Africa . 9 parts In-Stock

1+ parts

$59.412

100+ parts

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9

$59.412

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Corphita

USA . 2,384 parts In-Stock

1+ parts

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2,384

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Parana Technologies

USA . 865 parts In-Stock

1+ parts

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100+ parts

$33.812

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865

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$33.812

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Overview

Elevate your designs with the ZPSD503B1-15LI from STMicroelectronics, a leader in innovative technology. This versatile multi-functional peripheral boasts unmatched reliability and performance, making it ideal for industrial applications ranging from automation to consumer electronics. With its robust ceramic-metal sealed package and exceptional operating range, this component ensures longevity and efficiency, delivering outstanding value that empowers your projects to excel.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials enhances durability and reliability, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on circuit boards, facilitating compact and densely packed designs.

Maximum Supply Voltage: 5.5 V

Operating with a maximum supply voltage of 5.5 V ensures compatibility with standard digital systems, reducing design complexity.

Address Bus Width: 16

A 16-bit address bus allows for addressing a larger memory space, enhancing the performance of applications requiring significant data processing.

Package Shape: SQUARE

The square package shape facilitates effective thermal management and uniform mounting, contributing to device reliability.

Power Supplies (V): 5

Designed to operate at 5 V power supplies makes it versatile for a wide range of electronic devices, ensuring easy integration.

No. of Terminals: 68

A terminal count of 68 provides ample connectivity options for interfacing with a variety of components, enhancing its utility.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window allows for easy optical inspection, facilitating quality assurance during manufacturing.

Minimum Supply Voltage: 4.5 V

The minimum operating voltage of 4.5 V provides flexibility in power supply design, accommodating various operational conditions.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C grants this product reliable performance in extreme cold environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish enhances solderability and conductivity, ensuring reliable electrical connections during assembly.

Ultraviolet Erasable: YES

With the ability to be ultraviolet erasable, this product allows for easy reprogramming, which is essential for prototyping and development.

Terminal Position: QUAD

The quad terminal position simplifies the design layout and improves accessibility for connections to other components.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm makes this component suitable for low-profile applications where space is a premium.

RAM Words: 512

Having 512 RAM words allows for efficient data handling and processing, suitable for applications requiring substantial data manipulation.

Width: 24.105 mm

A width of 24.105 mm makes this product compatible with a variety of circuit designs, providing flexibility in the layout.

External Data Bus Width: 16

With a 16-bit data bus width, this product can transfer data efficiently, improving overall system throughput.

Maximum Clock Frequency: 34.48 MHz

A max clock frequency of 34.48 MHz allows for fast processing speeds, which is crucial for time-sensitive applications.

Length: 24.105 mm

The length of 24.105 mm complements its width effectively, providing compactness for easier integration into space-constrained applications.

Temperature Grade: INDUSTRIAL

This industrial temperature grade indicates robustness and reliability for use in harsh environments, critical for long-term applications.

ROM Bits Size: 1024 Bits

With a ROM of 1024 bits, this component permits substantial program storage, supportive of complex applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it suitable for battery-operated devices.

Terminal Form: J BEND

The J bend terminal form aids in easy soldering and placement on PCB, enhancing manufacturability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures design simplicity and universality in consumer electronics.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility ensures flexibility in application, allowing integration with various legacy and modern systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact placements while maintaining a reliable connection, ideal for high-density applications.

Maximum Standby Current: 0.00002 Amp

A maximum standby current of only 0.00002 Amp enhances energy efficiency, making it suitable for power-sensitive applications.

Maximum Access Time: 0.00000015 ns

The incredibly fast access time ensures efficient data retrieval, crucial for high-performance computing environments.

No. of I/O Lines: 40

Having 40 I/O lines provides ample interfacing capabilities for connecting to multiple peripherals, enhancing versatility.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD503B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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