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MCIMX6G2DVK05AB

NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors

MCIMX6G2DVK05AB by NXP Semiconductors is a multi-functional peripheral IC with integrated cache and low power mode. It features an address bus width of 26, external data bus width of 16, and operates at a speed of 528 rpm. Ideal for applications requiring high-speed processing in compact electronic devices.

Median Price

$13.575

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$18.720

100+ parts

$13.150

1k+ parts

$12.350

10k+ parts

-

260

$18.720

$13.150

$12.350

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Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$10.860

1k+ parts

$9.720

10k+ parts

$9.140

260

-

$10.860

$9.720

$9.140

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$13.575

1k+ parts

$12.150

10k+ parts

$11.425

260

-

$13.575

$12.150

$11.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,576 parts In-Stock

1+ parts

$11.448

100+ parts

-

1k+ parts

-

10k+ parts

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2,576

$11.448

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-

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Flip Electronics

USA . 14,300 parts In-Stock

1+ parts

-

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14,300

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-

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Vyrian

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

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2,287

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-

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Anansix

USA . 753 parts In-Stock

1+ parts

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753

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 260 parts In-Stock

1+ parts

$10.240

100+ parts

-

1k+ parts

-

10k+ parts

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260

$10.240

-

-

-

Corphita

USA . 331 parts In-Stock

1+ parts

$10.845

100+ parts

-

1k+ parts

-

10k+ parts

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331

$10.845

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AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$11.523

100+ parts

-

1k+ parts

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10k+ parts

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611

$11.523

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-

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Corohmni

South Africa . 2,504 parts In-Stock

1+ parts

$18.289

100+ parts

-

1k+ parts

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10k+ parts

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2,504

$18.289

-

-

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Aztec Data Supply Inc.

USA . 190 parts In-Stock

1+ parts

$29.120

100+ parts

-

1k+ parts

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10k+ parts

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190

$29.120

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-

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Microchip USA

USA . 1,420 parts In-Stock

1+ parts

$41.592

100+ parts

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10k+ parts

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1,420

$41.592

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Continental Prestige Electronics

USA . 6,807 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,807

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Argo Parts USA

USA . 5,110 parts In-Stock

1+ parts

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5,110

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

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-

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UNI Independent Distributors

Spain . 1,740 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,740

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Overview

Enhance your devices with the MCIMX6G2DVK05AB by NXP Semiconductors, a top-tier manufacturer of cutting-edge technology. This Multi-functional Peripherals component boasts integrated cache and low power mode, making it a versatile solution for a wide range of applications. With a durable plastic/epoxy body and excellent performance parameters, this product offers exceptional value and benefits to customers seeking reliability and efficiency in their electronic designs. Experience the advantage of top-of-the-line technology with the MCIMX6G2DVK05AB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and resistance to damage, making the product long-lasting.

Integrated Cache:

YES - The integrated cache improves processing speed and efficiency, making the product ideal for handling multiple tasks simultaneously.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving design, making the product suitable for compact workspaces.

Maximum Supply Voltage:

1.3 V - The high maximum supply voltage ensures stable performance and reliable operation of the product.

Address Bus Width:

26 - The wide address bus width allows for efficient data transfer and processing, enhancing overall performance.

Package Shape:

SQUARE - The square package shape provides a compact and organized layout, making the product easy to handle and install.

No. of Terminals:

272 - The high number of terminals allows for versatile connectivity options, making the product compatible with various devices and systems.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - This package style offers a space-efficient design with high terminal density, making the product suitable for modern electronic devices.

Minimum Supply Voltage:

1.15 V - The low minimum supply voltage helps in reducing power consumption and heat generation, enhancing energy efficiency.

Maximum Operating Temperature:

95 °C - The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Technical Specifications

Multi-functional Peripherals MCIMX6G2DVK05AB attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

26

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B272

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.23 mm

Speed:

528 rpm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MCIMX6G2DVK05AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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