Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.
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This material provides durability and light weight, making the product easy to handle and transport.
Surface mount technology allows for efficient installation and space-saving design.
A higher maximum supply voltage can provide more power for advanced functions and performance.
The square shape is versatile and allows for efficient use of space in compact devices.
The high number of terminals enables connectivity with a wide range of interfaces and peripherals.
The grid array and fine pitch design provide high density and reliability for complex electronic components.
A low minimum supply voltage indicates efficient power consumption and energy savings.
Tin silver finish offers excellent conductivity and resistance to corrosion for long-lasting performance.
Bottom terminal position makes it easier to integrate into a variety of devices and PCB layouts.
A low seated height allows for slim and compact design of the overall product.
The 19 mm width provides a balance between compactness and accessibility for maintenance and repairs.
A longer time at peak reflow temperature ensures proper soldering and reliability of the product during manufacturing.
High peak reflow temperature ensures proper soldering and bonding of electronic components for durability.
The 19 mm length complements the width of the product, maintaining a balanced and compact form factor.
CMOS technology provides low power consumption, high speed, and compatibility with a wide range of devices and systems.
Ball terminal form ensures reliable connectivity and durability for long-term use.
The nominal supply voltage provides a stable power source for consistent performance and efficiency.
The 0.8 mm terminal pitch allows for high density and space-saving layout on PCBs, ideal for compact devices.
MSL level 3 indicates that the product can withstand moderate exposure to moisture during handling and assembly processes.
Multi-functional Peripherals MCIMX535DVV2C attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
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Package Body Material:
Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
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Maximum Time At Peak Reflow Temperature (s):
Width:
MCIMX535DVV2C Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Kec
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Weitron Technology
DRA793BDGCBDRQ1
Texas Instruments
DRA793BDGCBDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 38.4 MHz max clock frequency. Ideal for automotive applications, it features a temperature grade of AUTOMOTIVE and compatibility with CAN, ETHERNET, I2C, IRDA, PCI, SPI, UART, and USB interfaces.
XDM504XXBABE
Multifunction Peripherals; Technology: CMOS;
CY8C24423A-24PVXI
Infineon Technologies
CY8C24423A-24PVXI by Infineon: 8-bit CPU, 4096 ROM words, 256 RAM bytes. Ideal for industrial applications with USB bus compatibility and operating temperature range of -40 to 85°C.
ST7590TR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
DRH402IPTP
MULTIFUNCTION PERIPHERAL;
CY8C5488FNI-LP212
Cypress Semiconductor
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 99; Package Code: VFBGA; Package Shape: RECTANGULAR;
CY8C4013LQI-411T
CY8C4013LQI-411T by Infineon: 16-terminal chip carrier with 1024 RAM words, 16 MHz clock frequency. Ideal for I2C bus applications in industrial settings due to -40 to 85 °C operating range and low 0.6 mm seated height.
DRF402BIZDU
CY8C27443-24SXI
CY8C27443-24SXI by Infineon Technologies is an 8-bit multi-functional peripheral with a max clock frequency of 24 MHz. It is commonly used in industrial applications and supports I2C and USB bus compatibility.
DRH404CIPTP
STIH412-HJB
Multifunction Peripherals;
CYBL10462-56LQXI
CYBL10462-56LQXI by Cypress Semiconductor is a 56-terminal chip carrier with 8192 RAM words. It operates at up to 48 MHz clock frequency, compatible with I2C bus, and has an industrial temperature grade. Ideal for multi-functional peripherals requiring low power consumption and high-speed data processing in various applications.
CY8C4014LQI-421
CY8C4014LQI-421 by Infineon: 16-terminal chip carrier with 1024 RAM words, 16 MHz clock frequency. Ideal for industrial applications requiring I2C bus compatibility and operating temperatures from -40 to 85°C.
MCIMX6Q5EYM10AE
NXP Semiconductors
Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
DRB404IPTP
DRA712BGGCBDQ1
DRA712BGGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 16-bit address bus width, and 512K RAM words. It is designed for automotive applications, featuring a max clock frequency of 32 MHz and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.
CY8C29866-24AXI
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
ZPSD511B1-70J
ZPSD511B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus architectures, making it ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.
STPCD0166BTC3
STPCD0166BTC3 by STMicroelectronics is a 32-bit multifunction peripheral IC with 388 terminals. It operates at a max clock frequency of 14.318 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, making it suitable for various commercial applications requiring high-speed data processing.
DRA725LGABCRQ1
DRA725LGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 38.4 MHz max clock frequency, and 512K RAM words. Ideal for automotive applications, it features a CMOS technology microprocessor with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility.
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MCIMX535DVV1CR2
Freescale Semiconductor
Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
MCIMX6Q5EYM10ADR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q5EYM10ACR
MCIMX6Q5EYM10ACR by NXP Semiconductors is a multi-functional peripheral with integrated cache and surface mount capability. It has a max supply voltage of 1.5V and is commonly used in applications such as grid arrays, heat sinks, and bottom terminal positions.
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
MCIMX6Q5EYM12AC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MCIMX257CJM4AR2
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM12AD
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6Q6AVT10ACR
MULTIFUNCTION PERIPHERAL; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 40; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX6G2AVM07AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX351AJQ5C
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX357CJQ5CR2
MCIMX6G2DVM05AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX356AJQ5C
MCIMX356AJQ5CR2
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER OVER NICKEL; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6Y0DVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y0CVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
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