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MCIMX535DVV2C

NXP Semiconductors

MCIMX535DVV2C by NXP Semiconductors

MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.

Median Price

$52.040

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MCIMX535DVV2C by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 68 parts In-Stock

1+ parts

$52.040

100+ parts

$48.910

1k+ parts

$44.230

10k+ parts

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68

$52.040

$48.910

$44.230

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$14.568

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10

$14.568

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Digiode

USA . 4,914 parts In-Stock

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$49.438

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$49.438

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Vyrian

USA . 5,018 parts In-Stock

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5,018

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Chip Stock

USA . 395 parts In-Stock

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395

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Anansix

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Distributors (Availability)

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AZTECH Wire

Italy . 526 parts In-Stock

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$11.571

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Continental Prestige Electronics

USA . 789 parts In-Stock

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$14.568

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$14.277

789

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$14.277

Netroflash

USA . 100 parts In-Stock

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$14.568

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100

$14.568

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$16.899

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$15.547

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$14.568

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$16.899

$15.547

$14.568

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Corohmni

South Africa . 435 parts In-Stock

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$21.788

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435

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One Stop Electronics

USA . 68 parts In-Stock

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$44.230

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Ampacity Inc.

Singapore . 68 parts In-Stock

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$44.230

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Semicontronic

India . 68 parts In-Stock

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$44.230

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$43.124

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$42.903

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68

$44.230

$43.124

$42.903

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Corphita

USA . 4,187 parts In-Stock

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$46.836

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Modulus Dynamics

Lithuania . 3,562 parts In-Stock

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$60.299

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$60.299

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$60.299

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3,562

$60.299

$60.299

$60.299

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Aztec Data Supply Inc.

USA . 197 parts In-Stock

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$64.730

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Robosynatics

Brazil . 4,333 parts In-Stock

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Lucentia Tech

USA . 4,333 parts In-Stock

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$54.851

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$53.731

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$53.731

4,333

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$53.731

Argo Parts USA

USA . 3,847 parts In-Stock

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Microchip USA

USA . 1,577 parts In-Stock

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UNI Independent Distributors

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Perfect Parts

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847

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Pacific Micro-Tech

USA . 140 parts In-Stock

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Overview

Unlock limitless possibilities with the MCIMX535DVV2C by NXP Semiconductors. Renowned for their top-notch quality and cutting-edge technology, NXP Semiconductors delivers a game-changing Multi-functional Peripheral that is versatile and efficient. Perfect for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers seeking reliable solutions. Experience seamless performance and innovation like never before with the MCIMX535DVV2C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and light weight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for efficient installation and space-saving design.

Maximum Supply Voltage: 1.4 V

A higher maximum supply voltage can provide more power for advanced functions and performance.

Package Shape: SQUARE

The square shape is versatile and allows for efficient use of space in compact devices.

No. of Terminals: 529

The high number of terminals enables connectivity with a wide range of interfaces and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design provide high density and reliability for complex electronic components.

Minimum Supply Voltage: 1.3 V

A low minimum supply voltage indicates efficient power consumption and energy savings.

Terminal Finish: TIN SILVER

Tin silver finish offers excellent conductivity and resistance to corrosion for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to integrate into a variety of devices and PCB layouts.

Maximum Seated Height: 1.85 mm

A low seated height allows for slim and compact design of the overall product.

Width: 19 mm

The 19 mm width provides a balance between compactness and accessibility for maintenance and repairs.

Maximum Time At Peak Reflow Temperature (s): 40

A longer time at peak reflow temperature ensures proper soldering and reliability of the product during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and bonding of electronic components for durability.

Length: 19 mm

The 19 mm length complements the width of the product, maintaining a balanced and compact form factor.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and compatibility with a wide range of devices and systems.

Terminal Form: BALL

Ball terminal form ensures reliable connectivity and durability for long-term use.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage provides a stable power source for consistent performance and efficiency.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high density and space-saving layout on PCBs, ideal for compact devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during handling and assembly processes.

Technical Specifications

Multi-functional Peripherals MCIMX535DVV2C attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e2

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.85 mm

Maximum Supply Voltage:

1.4 V

Minimum Supply Voltage:

1.3 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Trade Compliance

MCIMX535DVV2C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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