Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.
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This material provides durability and light weight, making the product easy to handle and transport.
Surface mount technology allows for efficient installation and space-saving design.
A higher maximum supply voltage can provide more power for advanced functions and performance.
The square shape is versatile and allows for efficient use of space in compact devices.
The high number of terminals enables connectivity with a wide range of interfaces and peripherals.
The grid array and fine pitch design provide high density and reliability for complex electronic components.
A low minimum supply voltage indicates efficient power consumption and energy savings.
Tin silver finish offers excellent conductivity and resistance to corrosion for long-lasting performance.
Bottom terminal position makes it easier to integrate into a variety of devices and PCB layouts.
A low seated height allows for slim and compact design of the overall product.
The 19 mm width provides a balance between compactness and accessibility for maintenance and repairs.
A longer time at peak reflow temperature ensures proper soldering and reliability of the product during manufacturing.
High peak reflow temperature ensures proper soldering and bonding of electronic components for durability.
The 19 mm length complements the width of the product, maintaining a balanced and compact form factor.
CMOS technology provides low power consumption, high speed, and compatibility with a wide range of devices and systems.
Ball terminal form ensures reliable connectivity and durability for long-term use.
The nominal supply voltage provides a stable power source for consistent performance and efficiency.
The 0.8 mm terminal pitch allows for high density and space-saving layout on PCBs, ideal for compact devices.
MSL level 3 indicates that the product can withstand moderate exposure to moisture during handling and assembly processes.
Multi-functional Peripherals MCIMX535DVV2C attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
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Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
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MCIMX535DVV2C Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
BAV99-7-F
Multicomp Pro
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
CY8C29466-24SXIT
Cypress Semiconductor
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
EFR32FG23B020F512IM48-BR
Silicon Labs
SYSTEM ON CHIP;
DRB404AIZDU
MULTIFUNCTION PERIPHERAL;
EFR32FG23B010F512IM48-B
STID337-DCB
STMicroelectronics
Multifunction Peripherals; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
CY8C5467AXI-LP108
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
ZPSD501B1V-20L
ZPSD501B1V-20L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5 V. It features 512 RAM words and supports various bus types, making it ideal for embedded systems. Its compact design ensures efficient integration in space-constrained applications.
EFR32FG23B010F128GM40-B
MCIMX535DVV1CR2
Freescale Semiconductor
Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
CY8C24223A-24PVXI
Infineon Technologies
CY8C24223A-24PVXI by Infineon: 8-bit, 24.6 MHz CPU with 4096 ROM words and 256 RAM bytes. Ideal for industrial applications, featuring USB bus compatibility and a max supply voltage of 5.25 V. Package style is small outline, shrink pitch with dual terminal position.
DRA712BEGCBDQ1
DRA712BEGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32MHz clock frequency, 538 terminals, and 262144 RAM words. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB bus compatibility. Operating temperature ranges from -40 to 125°C.
DRA712BGGCBDQ1
DRA712BGGCBDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 16-bit address bus width, and 512K RAM words. It is designed for automotive applications, featuring a max clock frequency of 32 MHz and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.
ZPSD501B1V-25U
ZPSD501B1V-25U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its low-profile design ensures efficient space utilization in electronic devices.
MIMX8ML4CVNKZAB
The NXP Semiconductors MIMX8ML4CVNKZAB is a multi-functional peripheral IC with 888832 RAM words, 24 MHz max clock frequency, and 160 I/O lines. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, SPI, UART, and USB bus compatibility in a compact square package with low profile grid array style.
ZPSD512B0-15L
ZPSD512B0-15L by STMicroelectronics is a versatile CMOS device with a 16-bit address bus and operates at a max voltage of 5.5V. It features 40 I/O lines, supports various bus types, and functions effectively in commercial applications up to 70 °C. Ideal for multi-functional peripherals, it offers reliable performance in compact designs.
CY8C5667LTI-LP041
Infineon's CY8C5667LTI-LP041 is a 68-terminal chip with 16384 RAM words, operating at up to 33 MHz. Ideal for industrial applications, it supports I2C, USB, and PS/2 bus compatibility with a max supply voltage of 5.5V. The CMOS technology device has a temperature range from -40°C to 85°C and features boundary scan capability.
CY8C5866AXI-LP020
CY8C5866AXI-LP020 by Infineon: 5.5V max supply, 33MHz clock, 72 I/O lines. Ideal for industrial applications requiring CMOS technology with I2C, USB, PS/2 bus compatibility in a compact square package.
PSD501B1-70U
The STMicroelectronics PSD501B1-70U is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded systems requiring low-profile packaging. Its commercial temperature range ensures reliable performance in diverse applications.
DRI404IZDU
CY8C4127FNI-BL483T
CY8C4127FNI-BL483T by Infineon is a multi-functional peripheral IC with 68 terminals, operating b/w -40 to 85 °C. It features 8192 RAM words, supports I2C, SPI, UART buses and has a supply current of 25 mA. Ideal for industrial applications requiring CMOS technology in a compact grid array package style.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MCIMX6Q5EYM10ADR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q5EYM10ACR
MCIMX6Q5EYM10ACR by NXP Semiconductors is a multi-functional peripheral with integrated cache and surface mount capability. It has a max supply voltage of 1.5V and is commonly used in applications such as grid arrays, heat sinks, and bottom terminal positions.
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
MCIMX6Q5EYM12AC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MCIMX257CJM4AR2
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM12AD
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6Q6AVT10ACR
MULTIFUNCTION PERIPHERAL; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 40; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX6Q5EYM10AE
Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MCIMX6G2AVM07AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX351AJQ5C
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX357CJQ5CR2
MCIMX6G2DVM05AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX356AJQ5C
MCIMX356AJQ5CR2
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER OVER NICKEL; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6Y0DVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y0CVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
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