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ZPSD512B1-70J

STMicroelectronics

ZPSD512B1-70J by STMicroelectronics

ZPSD512B1-70J by STMicroelectronics is a versatile 68-terminal chip carrier with a 16-bit address bus and operates at a max voltage of 5.5V. It supports multiple bus types, making it ideal for embedded systems. With a max clock frequency of 50 MHz, it ensures efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,879 parts In-Stock

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2,879

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Vyrian

USA . 2,324 parts In-Stock

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2,324

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Anansix

USA . 2,299 parts In-Stock

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2,299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 124 parts In-Stock

1+ parts

$24.530

100+ parts

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124

$24.530

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IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$41.143

100+ parts

-

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$37.029

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642

$41.143

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$37.029

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MKK Technologies

India . 805 parts In-Stock

1+ parts

$77.367

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805

$77.367

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DigiPath Technology Company

USA . 805 parts In-Stock

1+ parts

$77.367

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805

$77.367

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Parana Technologies

USA . 515 parts In-Stock

1+ parts

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$49.193

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515

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$49.193

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Corphita

USA . 232 parts In-Stock

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Overview

Unlock endless possibilities with the ZPSD512B1-70J from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers this versatile multi-functional peripheral designed to enhance your projects. With its compact design and robust performance, it’s perfect for a variety of applications—from consumer electronics to industrial systems. Experience reliability, efficiency, and superior technology that empowers your designs and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on printed circuit boards, enhancing overall product versatility.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V offers flexibility in power supply configurations while maintaining safe operating conditions.

Address Bus Width: 16

With a 16-bit address bus width, it can access a larger memory space, making it ideal for more complex applications.

Package Shape: SQUARE

The square package shape provides equal dimensions, allowing for standardized mounting and alignment on PCBs.

Power Supplies (V): 5

Operating at 5V simplifies integration with common electronic systems, enhancing compatibility.

No. of Terminals: 68

Having 68 terminals allows for numerous connections and functionality, supporting a wide range of peripheral attachments.

Package Style (Meter): CHIP CARRIER

Chip carrier package style facilitates easy handling and mounting for manufacturing processes.

Minimum Supply Voltage: 4.5 V

The capability to operate down to 4.5V ensures reliable performance even in low-power scenarios.

Maximum Operating Temperature: 70 °C

An operational temperature limit of 70 °C allows for use in environments subject to higher heat, ensuring robustness.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C enables the product to function in various environmental conditions, expanding its usability.

Terminal Finish: TIN LEAD

Tin-lead terminal finishes improve solderability, ensuring reliable electrical connections.

Ultraviolet Erasable: N

While not UV erasable, this specification indicates reliability in operation, suited for applications where reprogramming is less critical.

Terminal Position: QUAD

Quad terminal positioning allows for a compact arrangement of connectivity, optimizing space on PCBs.

Maximum Seated Height: 4.57 mm

A low seated height contributes to a sleek design, suitable for integration into compact devices.

RAM Words: 1024

1024 RAM words provide ample memory for handling data and executing functions effectively.

Width: 24.18 mm

A width of 24.18mm is conducive to modular designs, enabling easy integration into larger systems.

External Data Bus Width: 8

An 8-bit external data bus width supports standard architectures, making integration straightforward.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz ensures high-speed processing capabilities for demanding applications.

Length: 24.18 mm

A length of 24.18mm allows for a compact form factor, maintaining a balance between size and functionality.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this product is suitable for general usage in consumer electronics.

ROM Bits Size: 512 Bits

A 512-bit ROM size supports essential system functions and basic applications, offering a foundation for device operation.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed operation, making it energy-efficient.

Terminal Form: J BEND

J bend terminals enable secure mounting and facilitate efficient connections on PCBs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with standard voltage levels in the industry, enhancing compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows use with various microcontrollers and processors, maximizing its application potential.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard PCB layout designs and easy manufacturing.

Maximum Standby Current: 0.00002 Amp

With a very low maximum standby current, this product is energy-efficient, contributing to reduced power consumption in idle states.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time enhances performance and responsiveness in high-speed applications.

No. of I/O Lines: 40

40 I/O lines provide substantial interfacing capabilities, allowing for multiple connections to peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD512B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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