Loading...

SSM1105V-90T1T

STMicroelectronics

SSM1105V-90T1T by STMicroelectronics

SSM1105V-90T1T by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates b/w 2.7V to 3.6V. It features a low-profile, fine-pitch package with 100 terminals, ideal for compact applications. Its commercial grade ensures reliable performance up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,127 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,127

-

-

-

-

Vyrian

USA . 969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

969

-

-

-

-

Anansix

USA . 373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

373

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,368 parts In-Stock

1+ parts

$13.973

100+ parts

-

1k+ parts

$12.576

10k+ parts

-

1,368

$13.973

-

$12.576

-

Corohmni

South Africa . 3,019 parts In-Stock

1+ parts

$19.819

100+ parts

-

1k+ parts

-

10k+ parts

-

3,019

$19.819

-

-

-

MKK Technologies

India . 1,131 parts In-Stock

1+ parts

$26.275

100+ parts

-

1k+ parts

-

10k+ parts

-

1,131

$26.275

-

-

-

DigiPath Technology Company

USA . 1,131 parts In-Stock

1+ parts

$26.275

100+ parts

-

1k+ parts

-

10k+ parts

-

1,131

$26.275

-

-

-

Corphita

USA . 4,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,305

-

-

-

-

Parana Technologies

USA . 619 parts In-Stock

1+ parts

-

100+ parts

$16.707

1k+ parts

-

10k+ parts

-

619

-

$16.707

-

-

Overview

Elevate your designs with the SSM1105V-90T1T from STMicroelectronics, a leader in quality and innovation. This versatile multi-functional peripheral is crafted for superior performance, ensuring reliability across various applications, from consumer electronics to industrial controls. Experience seamless integration with its compact design and low power consumption, empowering you to create cutting-edge solutions that stand out in today's competitive market. Unlock new possibilities and drive efficiency with ST’s trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body enhances the product's resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and improved performance, which is ideal for modern, space-constrained devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources while allowing efficient energy consumption.

Address Bus Width: 16

The 16-bit address bus width enables the device to address a large memory space, enhancing data handling capabilities.

Package Shape: SQUARE

The square shape of the package allows for an efficient layout in printed circuit boards (PCBs), utilizing space effectively.

No. of Terminals: 100

Having 100 terminals provides versatile connectivity options, accommodating various peripheral devices seamlessly.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design minimizes the thickness of the component, making it ideal for thin and compact electronic products.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7V allows the product to function efficiently even in low-power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance in warm environments, widening application scope.

Minimum Operating Temperature: 0 °C

Operational range starting from 0 °C ensures that the product works well in colder climates, enhancing versatility.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish provides excellent solderability and long-term reliability for robust connections in various conditions.

Terminal Position: QUAD

The quad terminal position facilitates better integration in multi-functional peripherals, improving overall layout design.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6 mm contributes to a compact design, making it suitable for slim electronic devices.

Width: 14 mm

The 14 mm width strikes a balance between compact size and necessary connectivity, making it fit well in many applications.

Boundary Scan: YES

Boundary scan support enhances testing and debugging capabilities of the circuit, ensuring reliability and easier maintenance.

External Data Bus Width: 16

An external data bus width of 16 allows for fast and efficient data transfer between the device and other components.

Length: 14 mm

The 14 mm length, combined with compact width, enables space-saving layouts while maintaining a good number of terminals.

Temperature Grade: COMMERCIAL

Classified under commercial temperature grades, this product is suitable for a wide range of everyday applications.

Technology: CMOS

Utilizing CMOS technology ensures lower power consumption and higher speed, enhancing overall efficiency.

Terminal Form: GULL WING

Gull wing terminal design provides enhanced solderability and robustness, making it easier to integrate into various PCBs.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V optimizes performance and power efficiency, making it ideal for battery-operated devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for a higher density of terminal connections, suitable for modern, compact electronic designs.

No. of I/O Lines: 68

With 68 I/O lines, this product supports extensive interfacing options, making it a versatile choice for multi-functional peripherals.

Technical Specifications

Multi-functional Peripherals SSM1105V-90T1T attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

68

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SSM1105V-90T1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1