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TDA2SXBTQABCRQ1

Texas Instruments

TDA2SXBTQABCRQ1 by Texas Instruments

TDA2SXBTQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART and USB bus compatibility. With low power mode and boundary scan feature, it ensures efficient performance in multi-functional peripherals.

Median Price

$102.634

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,838 parts In-Stock

1+ parts

$72.039

100+ parts

$69.873

1k+ parts

$54.165

10k+ parts

-

1,838

$72.039

$69.873

$54.165

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$133.230

100+ parts

$105.940

1k+ parts

-

10k+ parts

-

6

$133.230

$105.940

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,458 parts In-Stock

1+ parts

$68.437

100+ parts

-

1k+ parts

-

10k+ parts

-

4,458

$68.437

-

-

-

Vyrian

USA . 2,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,498

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 603 parts In-Stock

1+ parts

$32.267

100+ parts

-

1k+ parts

$103.359

10k+ parts

-

603

$32.267

-

$103.359

-

ChromeModa Solutions

Germany . 6,646 parts In-Stock

1+ parts

$36.255

100+ parts

$29.729

1k+ parts

-

10k+ parts

-

6,646

$36.255

$29.729

-

-

IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$36.255

100+ parts

$34.442

1k+ parts

$32.630

10k+ parts

-

1,305

$36.255

$34.442

$32.630

-

Corphita

USA . 2,632 parts In-Stock

1+ parts

$64.835

100+ parts

-

1k+ parts

-

10k+ parts

-

2,632

$64.835

-

-

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$84.841

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$84.841

-

-

-

Lixinc

USA . 6,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,788

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

-

DigiPath Technology Company

USA . 319 parts In-Stock

1+ parts

-

100+ parts

$32.688

1k+ parts

-

10k+ parts

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319

-

$32.688

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-

Infinite Electronics LLP (Excess)

. 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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68

-

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Overview

Experience unparalleled performance and efficiency with the TDA2SXBTQABCRQ1 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This multi-functional peripheral device offers endless possibilities in various applications, providing customers with unmatched value and benefits. Say goodbye to limitations and hello to seamless operation with this product that guarantees quality, reliability, and innovation like no other. Elevate your projects to new heights with the TDA2SXBTQABCRQ1 and witness the difference it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures efficient power consumption and optimal performance of the device.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes the product suitable for use in varying environmental conditions.

Maximum Clock Frequency: 38.4 MHz

With a maximum clock frequency of 38.4 MHz, the product can handle high-speed data processing tasks efficiently.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The product's compatibility with various bus protocols makes it versatile and easily integrable with existing systems.

Technical Specifications

Multi-functional Peripherals TDA2SXBTQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1176 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2SXBTQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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