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ZPSD503B1-70J

STMicroelectronics

ZPSD503B1-70J by STMicroelectronics

ZPSD503B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,540

-

-

-

-

Digiode

USA . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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370

-

-

-

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Anansix

USA . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

263

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$22.493

100+ parts

-

1k+ parts

$20.244

10k+ parts

-

1,032

$22.493

-

$20.244

-

MKK Technologies

India . 1,269 parts In-Stock

1+ parts

$42.297

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$42.297

-

-

-

DigiPath Technology Company

USA . 1,269 parts In-Stock

1+ parts

$42.297

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$42.297

-

-

-

Corohmni

South Africa . 2,617 parts In-Stock

1+ parts

$80.095

100+ parts

-

1k+ parts

-

10k+ parts

-

2,617

$80.095

-

-

-

Corphita

USA . 3,752 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,752

-

-

-

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Parana Technologies

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$26.894

1k+ parts

-

10k+ parts

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125

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$26.894

-

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Overview

Unlock the potential of your designs with the ZPSD503B1-70J from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile multi-functional peripheral ensures reliability and performance across diverse applications, from consumer electronics to industrial automation. With its efficient power management and robust design, it optimizes functionality while reducing costs, making it the go-to choice for engineers seeking quality and value. Elevate your projects with the assurance of ST's excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice ensures durability, lightweight construction, and effective protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making this product ideal for modern applications.

Maximum Supply Voltage: 5.5 V

A maximum voltage of 5.5 V ensures safety and compatibility with various circuits and devices.

Address Bus Width: 16

A 16-bit address bus width enables the product to access a larger memory space, enhancing performance in data processing applications.

Package Shape: SQUARE

The square shape facilitates efficient use of PCB space, allowing for easier integration into a range of devices.

Power Supplies: 5 V

Designed to operate at a standard 5 V power supply, this product is compatible with a wide variety of equipment.

No. of Terminals: 68

With 68 terminals, this product provides ample connectivity options, supporting a range of functionalities in multifunctional peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is suitable for high-density applications, making it versatile for numerous electronic designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can operate efficiently in low-power environments.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C makes the product reliable for use in higher temperature environments.

Minimum Operating Temperature: 0 °C

This capability allows the product to function effectively in various temperature conditions, increasing its application range.

Terminal Finish: TIN LEAD

Tin-lead finishes provide good solderability and reliability in connections, ensuring stable performance over time.

Terminal Position: QUAD

Quad terminal positioning allows for more efficient routing on PCB layouts, facilitating better electronic design.

Maximum Seated Height: 4.57 mm

The compact height allows for integration into slim designs, beneficial for modern electronics where space is a premium.

RAM Words: 512

With 512 RAM words, this product can manage and store more data, improving performance in processing tasks.

Width: 24.18 mm

A width of 24.18 mm provides a balanced size that fits into standard layouts while maximizing functionality.

External Data Bus Width: 16

A 16-bit external data bus width enhances the product's capability to handle larger data transfers, increasing efficiency.

Maximum Clock Frequency: 50 MHz

A high clock frequency allows for faster processing speeds, making this product suitable for performance-critical applications.

Length: 24.18 mm

The length complements the width, providing a square form factor that integrates well with various configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures that the product is suitable for consumer electronics, offering reliability in everyday use.

ROM Bits Size: 1024 Bits

The ROM size accommodates a significant amount of program data, making the product suitable for more complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: J BEND

J Bend terminals facilitate easy soldering and a secure connection to the PCB, enhancing installation and reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V ensures compatibility with numerous electronic components and power supplies.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows easy integration with various existing systems, enhancing the product's usability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many devices, making this product easy to mount on typical PCB designs.

Maximum Standby Current: 0.00002 Amp

This low standby current ensures minimal power consumption when idle, which is essential for energy-efficient designs.

Maximum Access Time: 0.00000007 ns

Extremely fast access time allows for quicker data retrieval, making the product suitable for high-speed applications.

No. of I/O Lines: 40

With 40 I/O lines, the product supports a wide range of connections to peripherals, enhancing its versatility in functionality.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD503B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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