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ZPSD511B1-70J

STMicroelectronics

ZPSD511B1-70J by STMicroelectronics

ZPSD511B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus architectures, making it ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,362 parts In-Stock

1+ parts

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4,362

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Digiode

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,847

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Anansix

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$53.676

100+ parts

-

1k+ parts

$48.309

10k+ parts

-

2,080

$53.676

-

$48.309

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MKK Technologies

India . 1,303 parts In-Stock

1+ parts

$100.935

100+ parts

-

1k+ parts

-

10k+ parts

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1,303

$100.935

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DigiPath Technology Company

USA . 1,303 parts In-Stock

1+ parts

$100.935

100+ parts

-

1k+ parts

-

10k+ parts

-

1,303

$100.935

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-

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Corphita

USA . 2,791 parts In-Stock

1+ parts

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2,791

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Parana Technologies

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

$64.178

1k+ parts

-

10k+ parts

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1,990

-

$64.178

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Overview

Unlock unparalleled performance with the ZPSD511B1-70J from STMicroelectronics, a leader in innovative technology solutions. This versatile multi-functional peripheral seamlessly adapts to various applications, ensuring reliability and efficiency in every setup. With its robust design and commitment to quality, STMicroelectronics delivers a product that enhances productivity while reducing operational costs. Experience the advantages of superior compatibility and high-speed processing, empowering your projects with unmatched precision and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures robustness, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and easier placement in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for integration with various power systems.

Address Bus Width: 16

A 16-bit address bus width enhances data processing capabilities, making the device efficient for complex tasks.

Package Shape: SQUARE

The square package shape enables efficient space utilization on a PCB, facilitating compact design.

Power Supplies (V): 5

Operating at 5 V makes it compatible with common electronic systems, ensuring ease of integration.

No. of Terminals: 68

With 68 terminals, this device has ample connection options for versatile applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for effective heat dissipation and better performance in high-demand applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V provides a stable range for operation, promoting reliability.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature ensures functionality in more demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C facilitates its use in cooler conditions without performance degradation.

Terminal Finish: TIN LEAD

Tin lead terminal finish enhances solderability, ensuring easier assembly and maintenance.

Ultraviolet Erasable: N

Not being UV erasable simplifies data integrity concerns in applications where data permanence is crucial.

Terminal Position: QUAD

Quad terminal positioning facilitates easier layout and routing on PCBs, improving design efficiency.

Maximum Seated Height: 4.57 mm

A low profile with a maximum seated height of 4.57 mm contributes to a compact design footprint.

RAM Words: 1024

1024 RAM words provide adequate memory space for efficient data processing and temporary storage.

Width: 24.18 mm

The width of 24.18 mm ensures compatibility with various modules and devices for streamlined integration.

External Data Bus Width: 8

An 8-bit external data bus allows for effective communication with other components, enabling better system performance.

Maximum Clock Frequency: 50 MHz

A 50 MHz clock frequency supports high-speed operations, making this device suitable for demanding tasks.

Length: 24.18 mm

The length of 24.18 mm complements the width and supports a compact design requirement.

Temperature Grade: COMMERCIAL

Rated for commercial temperature conditions, this device is reliable for a wide range of consumer applications.

ROM Bits Size: 256 Bits

256 bits of ROM provides a reasonable amount of preliminary data storage for system programming.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing the overall efficiency of the device.

Terminal Form: J BEND

J bend terminals offer convenient mounting and enhance stability in physical connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures it operates within the preferred range for maximum efficiency.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility makes this device versatile, allowing use in various existing systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports modern PCB designs and component placements.

Maximum Standby Current: 0.00002 Amp

A minimal standby current ensures energy efficiency, benefiting battery-powered devices.

Maximum Access Time: 0.00000007 ns

An extremely fast access time facilitates high-speed data retrieval, improving performance in critical applications.

No. of I/O Lines: 40

Having 40 I/O lines offers significant connectivity options for interfacing with other devices and components.

Technical Specifications

Multi-functional Peripherals ZPSD511B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD511B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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