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PSD503B1-15U

STMicroelectronics

PSD503B1-15U by STMicroelectronics

PSD503B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its low-profile design ensures efficient space utilization in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,720 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,720

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-

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Vyrian

USA . 2,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,388

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-

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Digiode

USA . 912 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,939 parts In-Stock

1+ parts

$54.640

100+ parts

-

1k+ parts

-

10k+ parts

-

4,939

$54.640

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-

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IDEA Electronic Components Group

UK . 526 parts In-Stock

1+ parts

$65.985

100+ parts

-

1k+ parts

$59.387

10k+ parts

-

526

$65.985

-

$59.387

-

MKK Technologies

India . 1,089 parts In-Stock

1+ parts

$124.081

100+ parts

-

1k+ parts

-

10k+ parts

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1,089

$124.081

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

$124.081

100+ parts

-

1k+ parts

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10k+ parts

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1,089

$124.081

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-

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Parana Technologies

USA . 458 parts In-Stock

1+ parts

-

100+ parts

$78.895

1k+ parts

-

10k+ parts

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458

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$78.895

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Corphita

USA . 123 parts In-Stock

1+ parts

-

100+ parts

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123

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Overview

Elevate your projects with the PSD503B1-15U from STMicroelectronics—where quality meets innovation. This multi-functional peripheral is designed for versatility, offering exceptional performance in a compact, low-profile package. Ideal for various applications, it guarantees reliability and efficiency. Trust in STMicroelectronics' legacy of excellence to enhance your designs, providing unmatched value and peace of mind for engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protection against environmental factors, contributing to the overall reliability of the multi-functional peripheral.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space on printed circuit boards, making this product suitable for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of devices while providing flexibility in power supply design.

Address Bus Width: 16

Having a 16-bit address bus width allows for a significant addressing capability, enhancing the memory and data handling capacity of the peripheral.

Package Shape: SQUARE

The square package shape optimizes space on PCB and facilitates easier alignment during assembly processes.

Power Supplies (V): 5

Designed with a standard power supply of 5 V, this product integrates seamlessly with most electronic systems and power sources.

No. of Terminals: 80

An ample number of 80 terminals provides multiple connectivity options, allowing for versatile integration in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is perfect for applications with space constraints, allowing for high-density mounting solutions.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation across a variety of conditions, maintaining performance in diverse environments.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can function effectively in warmer environments, widening its usability.

Minimum Operating Temperature: 0 °C

Starting from 0 °C allows the product to operate in a wide range of cold environments, making it suitable for various applications.

Terminal Finish: TIN LEAD

A tin-lead terminal finish improves solderability and reduces oxidation, ensuring reliable connections in electronic assemblies.

Ultraviolet Erasable: N

Not being ultraviolet erasable simplifies the design and operation of the component, streamlining its use in applications that don't require UV erasure.

Terminal Position: QUAD

The quad terminal position allows for a compact layout while ensuring efficient signal routing and better performance.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a low-profile design, facilitating space-saving and versatile placement on PCBs.

RAM Words: 512

512 RAM words provide substantial temporary data storage, enabling efficient processing and multitasking for applications.

Width: 14 mm

The 14 mm width offers a compact footprint, allowing it to fit into small enclosures and circuit designs without compromising performance.

External Data Bus Width: 16

A 16-bit external data bus width enhances data throughput, ensuring quick and efficient communication with other devices.

Maximum Clock Frequency: 34.48 MHz

Operation at a maximum clock frequency of 34.48 MHz allows for high-speed processing, making the peripheral efficient for demanding applications.

Length: 14 mm

Combining a length of 14 mm with a corresponding width ensures a uniform size, which is beneficial for layout design.

Temperature Grade: COMMERCIAL

Rated for commercial temperature, this peripheral is reliable for general-use applications, balancing performance and cost-effectiveness.

ROM Bits Size: 1024 Bits

With a ROM size of 1024 bits, this product has sufficient firmware storage for operations, ensuring versatility in various tasks.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and performance, making this peripheral a smart choice for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates ease of soldering and improved mechanical stability, enhancing assembly reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with industry standards, making it a compatible and reliable choice for various systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures this product can be integrated into a diverse array of systems and applications, enhancing its versatility.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for dense component placement, optimizing space on PCBs.

Maximum Standby Current: 0.00002 Amp

Low maximum standby current enhances energy efficiency, making this peripheral an eco-friendly option for power-sensitive projects.

Maximum Access Time: 0.00000015 ns

A maximum access time of 0.15 ns significantly enhances data retrieval speed, improving overall system performance.

No. of I/O Lines: 40

With 40 I/O lines available, this product supports a wide range of peripheral connections and operations, enhancing its functionality.

Technical Specifications

Multi-functional Peripherals PSD503B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD503B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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